WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2012093910) CURABLE COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/093910    International Application No.:    PCT/KR2012/000184
Publication Date: 12.07.2012 International Filing Date: 06.01.2012
IPC:
C08L 83/04 (2006.01), C08K 5/5415 (2006.01), C08G 77/04 (2006.01), H01L 23/29 (2006.01), G02F 1/13357 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 20, Yoido-dong, Youngdungpo-gu Seoul 150-721 (KR) (For All Designated States Except US).
CHOI, Bum Gyu [KR/KR]; (KR) (For US Only).
KO, Min Jin [KR/KR]; (KR) (For US Only).
MOON, Myung Sun [KR/KR]; (KR) (For US Only).
JUNG, Jae Ho [KR/KR]; (KR) (For US Only).
KANG, Dae Ho [KR/KR]; (KR) (For US Only).
KIM, Min Kyoun [KR/KR]; (KR) (For US Only).
CHO, Byung Kyu [KR/KR]; (KR) (For US Only)
Inventors: CHOI, Bum Gyu; (KR).
KO, Min Jin; (KR).
MOON, Myung Sun; (KR).
JUNG, Jae Ho; (KR).
KANG, Dae Ho; (KR).
KIM, Min Kyoun; (KR).
CHO, Byung Kyu; (KR)
Agent: DANA PATENT LAW FIRM; 5th Floor, BYC Bldg., 648-1 Yeoksam-dong, Gangnam-gu Seoul 135-080 (KR)
Priority Data:
10-2011-0001473 06.01.2011 KR
10-2012-0002158 06.01.2012 KR
Title (EN) CURABLE COMPOSITION
(FR) COMPOSITION DURCISSABLE
(KO) 경화성 조성물
Abstract: front page image
(EN)The present invention relates to a curable composition and a use therefor. One example of the curable composition can exhibit high processability and workability. Also, the curable composition can exhibit a high refractive index. The composition has low water transmittance before or after curing, and has superior resistance to cracking, resistance to heat shock, adhesive property, and hardness. In addition, the composition does not cause color change, such as whitening, under high temperature or high humidity, and does not exhibit stickiness on the surface. One example of the curable composition can be used as an adhesive material or as an encapsulation material for semiconductor elements such as a LED, a CCD, a photo coupler, or a photovoltaic cell.
(FR)L'invention concerne une composition durcissable et une utilisation de cette composition. Un exemple de cette composition durcissable peut présenter une grande aptitude au traitement et au façonnage. La composition durcissable selon l'invention peut également avoir un indice de réfraction élevé. Elle présente un facteur de transmission dans l'eau faible avant ou après le durcissement, ainsi qu'une résistance supérieure à la fissuration, une résistance aux chocs thermiques, des propriétés adhésives et de dureté. En outre, cette composition n'entraîne pas de changement de couleur, tel qu'un blanchiment, à température ou humidité élevée et ne présente pas d'adhésivité de surface. Un exemple de cette composition durcissable peut être utilisé comme matériau adhésif ou comme matériau d'encapsulation pour des éléments semiconducteurs tels que des DEL, des DTC, des photocoupleurs ou des cellules photovoltaïques.
(KO)본 발명은, 경화성 조성물 및 그 용도에 관한 것이다. 하나의 예시적인 경화성 조성물은, 우수한 가공성 및 작업성을 나타낼 수 있다. 또한, 상기 경화성 조성물은, 경화 전 또는 후에 높은 굴절률을 나타낼 수 있다. 상기 조성물은 경화 전 또는 후에 수분 투과율이 낮고, 균열 내성, 내열 충격성, 접착성 및 경도가 우수하다. 또한, 상기 조성물은 고온 또는 고습 조건에서 백탁 등의 색변화를 유발하지 않고, 표면에서의 끈적임도 나타내지 않는다. 하나의 예시에서 상기 경화성 조성물은, LED, CCD, 포토 커플러 또는 광전지 등과 같은 반도체 소자에 대한 접착 소재 또는 봉지 소재 등으로 사용될 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)