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Machine translation
1. (WO2012093895) RESIN COMPOSITION, PREPREG USING SAME, AND PRINTED WIRING BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/093895    International Application No.:    PCT/KR2012/000166
Publication Date: 12.07.2012 International Filing Date: 06.01.2012
IPC:
C08L 63/00 (2006.01), C08K 3/22 (2006.01), C08K 3/38 (2006.01), C08J 5/24 (2006.01), H05K 1/03 (2006.01)
Applicants: DOOSAN CORPORATION [KR/KR]; 18-12 Euljiro 6-ga, Jung-gu Seoul 100-730 (KR) (For All Designated States Except US).
HAN, Seung Jin [KR/KR]; (KR) (For US Only).
NA, Jea Ik [KR/KR]; (KR) (For US Only).
CHO, Kyeong Woon [KR/KR]; (KR) (For US Only)
Inventors: HAN, Seung Jin; (KR).
NA, Jea Ik; (KR).
CHO, Kyeong Woon; (KR)
Agent: KIM, Kee Hyo; 14F., Kukdong Building, 60-1 Chungmuro3-ka, Chung-ku Seoul 100-705 (KR)
Priority Data:
10-2011-0001378 06.01.2011 KR
Title (EN) RESIN COMPOSITION, PREPREG USING SAME, AND PRINTED WIRING BOARD
(FR) COMPOSITION DE RÉSINE, PRÉ-IMPRÉGNÉ L'UTILISANT, ET CARTE DE CIRCUIT IMPRIMÉ
(KO) 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판
Abstract: front page image
(EN)The present invention provides a resin composition for forming a printed wiring board, a prepreg formed from the resin composition, and a printed wiring board including the prepreg, wherein the resin composition comprises (a) an epoxy resin having at least two epoxy groups within one molecule, (b) one or more curing components selected from the group consisting of a curing agent and a curing accelerator, and (c) an inorganic filler, wherein the inorganic filler comprises alumina and boron nitride and the content of boron nitride is in a range of 5-50 parts by weight based on 100 parts by weight of alumina. The invention adopts an alumina inorganic filler and boron nitride with low hardness, a low thermal expansion coefficient, and high thermal conductivity. Therefore, the reliability of a semiconductor package can be improved due to excellent drilling processability and heat conductivity and a low thermal expansion coefficient.
(FR)Cette invention concerne une composition de résine pour former une carte de circuit imprimé, un pré-imprégné formé à partir de la composition de résine, et une carte de circuit imprimé contenant le pré-imprégné. La composition de résine comprend (a) une résine époxy ayant au moins deux groupes époxy par molécule, (b) un ou plusieurs composants de durcissage choisis dans le groupe constitué par un agent de durcissage et un accélérateur de durcissage, et (c) une charge inorganique, ladite charge inorganique comprenant de l'alumine et du nitrure de bore à une teneur de nitrure de bore dans une plage de 5 à 50 parties en poids pour 100 parties en poids d'alumine. L'invention utilise une charge inorganique de type alumine et du nitrure de bore de basse dureté, bas coefficient de dilatation thermique, et conductivité thermique élevée. Par conséquent, la fiabilité d'un boîtier de semi-conducteur peut être améliorée grâce à une excellente facilité de mise en œuvre par perçage et conductivité thermique et à un bas coefficient de dilatation thermique.
(KO)본 발명은 (a) 1분자 중에 적어도 2개 이상의 에폭시기를 갖는 에폭시 수지; (b) 경화제 및 경화촉진제로 구성된 군으로부터 선택된 1종 이상의 경화 성분; 및 (c) 무기 충전제를 포함하며, 상기 무기 충전제는 알루미나 및 질화붕소를 포함하되, 질화붕소의 함량이 알루미나 100 중량부 대비 5 내지 50 중량부 범위인 것이 특징인 프린트 배선판 형성용 수지 조성물, 상기 수지 조성물로부터 형성된 프리프레그 및 상기 프리프레그를 포함하는 프린트 배선판을 제공한다. 본 발명에서는 낮은 경도와 저열팽창율, 열전도성이 높은 질화붕소와 알루미나 무기 필러를 무기 충전제로 채택하여 사용하므로, 드릴 가공성, 열전도성이 우수하고 낮은 열팽창계수로 인해 반도체 패키지의 신뢰성을 향상시킬 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)