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Machine translation
1. (WO2012093841) STACKED-TYPE HEAT SINK APPARATUS FOR ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/093841    International Application No.:    PCT/KR2012/000063
Publication Date: 12.07.2012 International Filing Date: 04.01.2012
IPC:
H05K 7/20 (2006.01), G06F 1/20 (2006.01)
Applicants: KAONMEDIA CO., LTD. [KR/KR]; 513-4 Yatap-dong, Bundang-gu Seongnam-si, Gyeonggi-do 463-839 (KR) (For All Designated States Except US).
KIM, Chul-Min [KR/KR]; (KR) (For US Only).
OH, Ung [KR/KR]; (KR) (For US Only).
RYU, Tae-Choul [KR/KR]; (KR) (For US Only)
Inventors: KIM, Chul-Min; (KR).
OH, Ung; (KR).
RYU, Tae-Choul; (KR)
Agent: KIM, Do-Hyoung; #102-3302 Daewoo Worldmark 996-3 Yongtong-dong, Yongtong-gu Suwon-si, Gyeonggi-do 443-851 (KR)
Priority Data:
10-2011-0001611 07.01.2011 KR
Title (EN) STACKED-TYPE HEAT SINK APPARATUS FOR ELECTRONIC DEVICE
(FR) APPAREIL DISSIPATEUR THERMIQUE DU TYPA À EMPILEMENT POUR DISPOSITIF ÉLECTRONIQUE
(KO) 적층방식의 전자기기용 히트싱크 장치
Abstract: front page image
(EN)The present invention relates to a stacked-type heat sink apparatus for an electronic device, which is simple to manufacture, is economically advantageous, and can effectively dissipate heat inside the electronic device. The present invention relates to the heat sink apparatus for dissipating to the outside of the electronic device, the heat that is generated from a main board (2), which is seated on the upper surface of the lower plate (1b) of the electronic device (1) comprising an upper plate (1a) and the lower plate (1b), and from a CPU (3), which is seated on the upper surface of the main board (2), and comprises: a heat dissipating plate (10), which is seated on the upper surface of the main board (2), is provided with a body having main walls in the up, down, left and right directions which are closed, and is formed in an oblong cross section that is penetrated in the front and back directions, for dissipating the heat that is generated from the main board (2) to the exterior by means of conduction; a plate-shaped heat conduction plate (20), which is coupled to the lower surface of the upper plate (1a) of the electronic device so as to be separated away from the upper end portion of the heat dissipating plate (10) at a predetermined distance; and an insertion-type heat pad (30), which is stacked so as to come into close contact with the upper surface of the heat dissipating plate (10) and the lower surface of the electronic device (1a) at the same time, for conducting the heat which is conducted along the heat dissipating plate (10) and moved vertically upward to the heat conduction plate (20).
(FR)L'invention concerne un appareil dissipateur thermique du type à empilement pour un dispositif électronique, simple à fabriquer, économiquement avantageux et pouvant dissiper efficacement la chaleur se trouvant dans le dispositif électronique. L'invention porte sur un appareil dissipateur thermique pour dissiper vers l'extérieur du dispositif électronique, la chaleur qui est générée par une carte-mère (2) prévue sur la surface supérieure de la plaque inférieure (1b) du dispositif électronique (1) comprenant une plaque supérieure (1a) et la plaque inférieure (1b), et par une UC (3) prévue sur la surface supérieure de la carte-mère (2). Ledit dispositif dissipateur comprend : une plaque de dissipation de chaleur (10) prévue sur la surface supérieure de la carte-mère (2), comportant un corps possédant des parois principales vers le haut, le bas, la gauche et la droite, qui sont fermées, et présente une section transversale oblongue qui est pénétrée vers l'avant et l'arrière, pour dissiper la chaleur qui est générée par la carte-mère vers l'extérieur par conduction; et une plaque de conduction thermique en forme de plaque (20) couplée à la surface inférieure de la plaque supérieure (1a) du dispositif électronique (1) de façon qu'elle soit séparée de la partie terminale supérieure de la plaque de dissipation thermique (10) à une distance prédéterminée; et une pastille thermique à insertion (30), qui est empilée de manière à venir en contact étroit avec la plaque de dissipation thermique (10) et en même temps avec la surface inférieure du dispositif électronique (1a), pour conduire la chaleur qui est conduite le long de la plaque de dissipation thermique (10) et déplacée verticalement jusqu'à la plaque de conduction thermique (20).
(KO)본 발명은 제작이 간편하고 경제적으로 유리하며 전자기기 내부의 열을 효과적으로 방열할 수 있는 적층방식의 전자기기용 히트싱크 장치에 관한 것이다. 본 발명은 상판(1a)과 하판(1b)으로 구성된 전자기기(1)의 하판(1b) 상면에 안착된 메인보드(2) 및 이 메인보드(2)의 상면에 안착된 CPU(3)로부터 발생되는 열을 전자기기(1)의 외부로 방열하는 히트싱크 장치로서, 메인보드(2)의 상면에 안착되고, 몸체는 상하좌우 방향의 주벽이 폐쇄되고 전후 방향으로 관통된 장방형의 단면으로 형성되며 메인보드(2)로부터 발생되는 열을 전도에 의해 외부로 방열하는 방열판(10); 방열판(10)의 상단부와 일정거리 이격되게 전자기기(1)의 상판(1a) 하면에 부착되며 전자기기(1) 내부의 열을 전도에 의해 외부로 방열하는 열전도판(20); 방열판(10)의 상면과 전자기기 상판(1a)의 하면에 동시에 밀착되게 적층되며 방열판(10)을 따라 전도되어 연직상방으로 이동한 열을 열전도판(20)에 전도하는 인서트형 히트패드(30);를 포함하여 구성된다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)