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Machine translation
1. (WO2012093142) FILAMENT FOR HOT WIRE CHEMICAL VAPOUR DEPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/093142    International Application No.:    PCT/EP2012/050100
Publication Date: 12.07.2012 International Filing Date: 04.01.2012
IPC:
C23C 16/448 (2006.01)
Applicants: ECHERKON TECHNOLOGIES LTD. [GB/GB]; 20 Springfield Road Crawley West-Sussex RH11 8AD (GB) (For All Designated States Except US).
TARAZONA LABRADOR, Antulio [GB/GB]; (GB) (For US Only)
Inventors: TARAZONA LABRADOR, Antulio; (GB)
Agent: TWELMEIER MOMMER & PARTNER; Westliche Karl-Friedrich-Straße 56-68 75172 Pforzheim (DE)
Priority Data:
11150048.4 04.01.2011 EP
Title (EN) FILAMENT FOR HOT WIRE CHEMICAL VAPOUR DEPOSITION
(FR) FILAMENT DESTINÉ AU DÉPÔT CHIMIQUE EN PHASE VAPEUR ASSISTÉ PAR FILAMENT CHAUD
Abstract: front page image
(EN)The invention refers to a refractory metal filament for hot wire chemical vapour deposition of semiconductor or dielectric layers, characterized in that at least two spaced apart sections of the filament are provided with a temperature resistant coating. The invention also refers to a method for making such a filament and its use for hot wire chemical vapour deposition of semiconductor or dielectric layers.
(FR)L'invention concerne un filament en métal réfractaire destiné au dépôt chimique en phase vapeur assisté par filament chaud de couches semi-conductrices ou diélectriques, qui se caractérise en ce qu'au moins deux sections espacées du filament sont pourvues d'un revêtement thermorésistant. L'invention concerne également un procédé de fabrication d'un tel filament et son utilisation pour le dépôt chimique en phase vapeur assisté par filament chaud de couches semi-conductrices ou diélectriques.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)