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Machine translation
1. (WO2012091697) PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/091697    International Application No.:    PCT/US2010/062226
Publication Date: 05.07.2012 International Filing Date: 28.12.2010
IPC:
H04R 19/00 (2006.01), H01L 23/02 (2006.01)
Applicants: KNOWLES ELECTRONICS, LLC [US/US]; 1151 Maplewood Drive Itasca, Illinois 60143 (US) (For All Designated States Except US).
LOEPPERT, Peter V. [US/US]; (US) (For US Only).
GIESECKE, Daniel [US/US]; (US) (For US Only).
MINERVINI, Anthony [US/US]; (US) (For US Only).
NIEW, Jeffery [US/US]; (US) (For US Only).
GRUNERT, Lawrence [US/US]; (US) (For US Only)
Inventors: LOEPPERT, Peter V.; (US).
GIESECKE, Daniel; (US).
MINERVINI, Anthony; (US).
NIEW, Jeffery; (US).
GRUNERT, Lawrence; (US)
Agent: KRATZ, Rudy; 120 S. LaSalle Street Suite 1600 Chicago, Illinois 60603 (US)
Priority Data:
Title (EN) PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE
(FR) BOÎTIER AYANT UNE PUCE CMOS POSITIONNÉE EN DESSOUS D'UNE PUCE MEMS
Abstract: front page image
(EN)A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
(FR)La présente invention se rapporte à un boîtier. Le boîtier comprend un substrat et un couvercle. On décrit une puce MEMS comprenant un diaphragme. On décrit également une puce CMOS, au moins une partie de la puce CMOS étant positionnée entre le diaphragme et le substrat.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)