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1. (WO2012091140) INTERPOSER AND SEMICONDUCTOR MODULE USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/091140    International Application No.:    PCT/JP2011/080528
Publication Date: 05.07.2012 International Filing Date: 28.12.2011
IPC:
H01L 23/36 (2006.01), H01L 23/32 (2006.01), H01L 25/065 (2006.01), H01L 25/07 (2006.01), H01L 25/18 (2006.01)
Applicants: ZyCube Co., Ltd. [JP/JP]; 4259-3, Nagatsuta-cho, Midori-ku, Yokohama-shi, Kanagawa 2268510 (JP) (For All Designated States Except US).
BONKOHARA, Manabu [JP/JP]; (JP) (For US Only)
Inventors: BONKOHARA, Manabu; (JP)
Agent: IZUMI, Katsufumi; 2nd Floor, Suganuma Bldg., 20-6, Toranomon 1-chome, Minato-ku, Tokyo 1050001 (JP)
Priority Data:
2010-294618 30.12.2010 JP
Title (EN) INTERPOSER AND SEMICONDUCTOR MODULE USING SAME
(FR) ÉLÉMENT INTERCALAIRE ET MODULE À SEMI-CONDUCTEURS METTANT EN OEUVRE CELUI-CI
(JA) インターポーザ及びそれを用いた半導体モジュール
Abstract: front page image
(EN)Provided is an interposer which, when placed between two heat sources, is capable of more effectively suppressing thermal conduction between the heat sources. An interposer (24) is provided with: a body having a cavity (23) maintained in a vacuum state; insulating layers (22a, 22b) respectively formed in an upper wall (20a) and lower wall (20b) of the body; and heat reflecting layers (21a, 21b) respectively formed on the insulating layers (22a, 22b). The interposer (24) thermally insulates between semiconductor devices (11a, 12a) mounted above and below the interposer.
(FR)L'invention concerne un élément intercalaire qui, lorsqu'il est placé entre deux sources de chaleur, permet de réguler efficacement la conduction thermique entre ces deux sources de chaleur. Cet élément intercalaire (24) comporte un corps principal possédant une cavité (23) vide, des couches d'isolation (22a) et (22b) formées respectivement sur les parois supérieure (20a) et inférieure (20b) du corps principal, ainsi que des couches de réflexion thermique (21a) et (21b) formées respectivement sur les couches d'isolation (22a) et (22b). Cet élément intercalaire (24) isole thermiquement les éléments à semi-conducteurs montés sur et sous cet élément intercalaire.
(JA) 二つの熱源の間に配置した際に、それら熱源間での熱伝導をより効果的に抑制することができるインターポーザを提供する。 インターポーザ24は、真空に維持されたキャビティ23を有する本体と、本体の上壁20aと下壁20bにそれぞれ形成された絶縁層22a及び22bと、絶縁層22a及び22bの上にそれぞれ形成された熱反射層21a及び21bとを備える。インターポーザ24は、その上下に搭載された半導体デバイス11aと12aの間を熱的に絶縁する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)