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1. (WO2012090959) RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2012/090959 International Application No.: PCT/JP2011/080118
Publication Date: 05.07.2012 International Filing Date: 26.12.2011
IPC:
G03F 7/004 (2006.01) ,C07C 22/02 (2006.01) ,C07C 309/19 (2006.01) ,C07C 313/04 (2006.01) ,C07C 381/12 (2006.01) ,C07D 307/00 (2006.01) ,C08K 5/42 (2006.01) ,C08L 101/02 (2006.01) ,G03F 7/039 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
22
Cyclic compounds containing halogen atoms bound to an acyclic carbon atom
02
having unsaturation in the rings
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
309
Sulfonic acids; Halides, esters, or anhydrides thereof
01
Sulfonic acids
02
having sulfo groups bound to acyclic carbon atoms
19
of a saturated carbon skeleton containing rings
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
313
Sulfinic acids; Sulfenic acids; Halides, esters or anhydrides thereof; Amides of sulfinic or sulfenic acids, i.e. compounds having singly-bound oxygen atoms of sulfinic or sulfenic groups replaced by nitrogen atoms, not being part of nitro or nitroso groups
02
Sulfinic acids; Derivatives thereof
04
Sulfinic acids; Esters thereof
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
381
Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/-C07C337/142
12
Sulfonium compounds
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
307
Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
36
Sulfur-, selenium-, or tellurium-containing compounds
41
Compounds containing sulfur bound to oxygen
42
Sulfonic acids; Derivatives thereof
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
02
characterised by the presence of specified groups
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
Applicants: NAKAHARA Kazuo[JP/JP]; JP (UsOnly)
MARUYAMA Ken[JP/JP]; JP (UsOnly)
JSR CORPORATION[JP/JP]; 9-2, Higashi-Shinbashi 1-chome, Minato-ku, Tokyo 1058640, JP (AllExceptUS)
Inventors: NAKAHARA Kazuo; JP
MARUYAMA Ken; JP
Agent: AMANO Kazunori; c/o Amano & Partners, 6th Floor, Fujikogyo-Nishimotomachi Building, 1-18, Aioi-cho 1-chome, Chuo-ku, Kobe-shi, Hyogo 6500025, JP
Priority Data:
2010-29336228.12.2010JP
Title (EN) RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND
(FR) COMPOSITION DE RÉSINE SENSIBLE AUX RAYONNEMENTS ET COMPOSÉ
(JA) 感放射線性樹脂組成物及び化合物
Abstract:
(EN) The purpose of the present invention is to meet the increasing demands on fine patterns in the microfabrication field, including the manufacture of integrated-circuit elements, by providing: a radiation-sensitive resin composition that not only has sufficient basic characteristics such as sensitivity and resolution but also has sufficient MEEF performance; and a compound suitable for said radiation-sensitive resin composition. The present invention is a radiation-sensitive resin composition that contains: a compound (A) that satisfies formula (1) and preferably satisfies formula (2); and a polymer (B) containing a constitutional unit that has an acid-dissociable group.
(FR) L'objet de la présente invention est de répondre aux demandes croissantes en matière de modèles fins dans le domaine de la microfabrication, notamment de la fabrication d'éléments de circuits intégrés, en proposant : une composition de résine sensible aux rayonnements qui présente non seulement des caractéristiques de base suffisantes, telles que la sensibilité et la résolution, mais également des performances MEEF suffisantes ; et un composé adapté à ladite composition de résine sensible aux rayonnements. La présente invention est une composition de résine sensible aux rayonnements qui contient : un composé (A) qui correspond à la formule (1) et de préférence à la formule (2) ; et un polymère (B) présentant un motif constitutionnel contenant un groupe dissociable avec un acide.
(JA)  本発明の目的は、集積回路素子等を製造する微細加工の分野におけるさらなる微細パターンの要求に応えるため、感度、解像性といった基本特性だけではなく、MEEF性能をも十分に満足する感放射線性樹脂組成物、及びこの感放射線性組成物に好適な化合物を提供することである。本発明は、[A]下記式(1)で表される化合物、及び[B]酸解離性基を有する構造単位を含む重合体を含有する感放射線性樹脂組成物である。また、[A]化合物は、下記式(2)で表される化合物であることが好ましい。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)