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1. (WO2012088756) CHEMICAL MECHANICAL POLISHING SLURRY FOR POLISHING TUNGSTEN
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/088756    International Application No.:    PCT/CN2011/002134
Publication Date: 05.07.2012 International Filing Date: 19.12.2011
IPC:
C09G 1/02 (2006.01)
Applicants: ANJI MICROELECTRONICS (SHANGHAI) CO., LTD [CN/CN]; Suite 602, Building #5, No.3000 Longdong AVE. Zhangjiang Hi-tech Park Pudong, Shanghai 201203 (CN) (For All Designated States Except US).
HE, Huafeng [CN/CN]; (CN) (For US Only).
WANG, Chen [CN/CN]; (CN) (For US Only)
Inventors: HE, Huafeng; (CN).
WANG, Chen; (CN)
Agent: HANHONG LAW FIRM; LI, Jiaming Room 1506-07 New HuangPu Financial Building, No. 61 East Nanjing Road Shanghai 200002 (CN)
Priority Data:
201010606954.9 27.12.2010 CN
Title (EN) CHEMICAL MECHANICAL POLISHING SLURRY FOR POLISHING TUNGSTEN
(FR) SUSPENSION DE POLISSAGE MÉCANIQUE ET CHIMIQUE POUR LE POLISSAGE DE TUNGSTÈNE
(ZH) 一种抛光钨的化学机械抛光液
Abstract: front page image
(EN)Disclosed in the present invention is chemical mechanical polishing slurry, comprising water, gas phase silicon dioxide, silver ions, sulphate ions and a peroxide. The polishing slurry has a very high speed for polishing tungsten, and at the same time enhances the polishing selection ratio of tungsten and silicon dioxide.
(FR)La présente invention concerne une suspension de polissage mécanique et chimique comprenant de l'eau, du dioxyde de silicium en phase gazeuse, des ions argent, des ions sulfate et un peroxyde. La suspension de polissage permet d'atteindre une vitesse de polissage du tungstène très élevée, tout en améliorant le rapport de sélection de polissage du tungstène et du dioxyde de silicium.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)