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1. WO2012079295 - METHOD AND SYSTEM FOR MANUFACTURING DEVICE USING SHADOW MASK TECHNOLOGY PRODUCTION LINE

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Publication Number WO/2012/079295
Publication Date 21.06.2012
International Application No. PCT/CN2011/070399
International Filing Date 19.01.2011
IPC
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
C23C 14/04 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
C23C 14/24 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
C23C 14/58 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
58After-treatment
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
C23C 14/042
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
042using masks
C23C 14/24
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
C23C 14/56
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Applicants
  • 潘重光 PAN, Chongguang [CN]/[CN]
Inventors
  • 潘重光 PAN, Chongguang
Agents
  • 厦门市新华专利商标代理有限公司 XIAMEN SHINHWA PATENT & TRADEMARK AGENCY CO., LTD.
Priority Data
201010591717.X16.12.2010CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) METHOD AND SYSTEM FOR MANUFACTURING DEVICE USING SHADOW MASK TECHNOLOGY PRODUCTION LINE
(FR) PROCÉDÉ ET SYSTÈME DE FABRICATION D'UN DISPOSITIF UTILISANT UNE LIGNE DE PRODUCTION À TECHNOLOGIE DE MASQUE D'OMBRAGE
(ZH) 一种采用荫罩技术生产线制造器件的方法及系统
front page image
Abstract
(EN)
A method and a system (100) for manufacturing a device using a shadow mask technology production line are provided. By this method, a material deposition in a deposition vacuum chamber (101A,101B,……101N-1,101N) is completed firstly, which includes the following steps: A, orienting a shadow mask board (11) accurately on a first region of a substrate (10) in accordance with an operational relationship between the shadow mask board (11) completely located in the deposition vacuum chamber (101A,101B,……101N-1,101N) and a deposition material source (14); B, depositing the material by vacuum evaporation on the first region of the substrate (10) to form a pattern; C, orienting the shadow mask board (11) and the deposition material source (14) accurately on a second region of the substrate (10) by gear; D, depositing the material by vacuum evaporation on the second region of the substrate (10) to form a pattern and to form a three-dimensional overlap between materials; according to a design, repeating step C and step D to complete compositions and connections of components; next, after annealing in an annealing vacuum chamber (102), testing in a test vacuum chamber (103), cutting in a cutting vacuum chamber (104) and assembling in an assembling vacuum chamber (105) in turn, prototyping and manufacturing of full components are achieved.
(FR)
L'invention concerne un procédé et un système (100) servant à fabriquer un dispositif utilisant une ligne de production à technologie de masque d'ombrage. Par ce procédé, une déposition de matériau dans une chambre de déposition sous vide (101A, 101B,… 101N-1, 101N) est d'abord réalisée, selon les étapes consistant : A, à orienter une carte de masque d'ombrage (11) avec précision sur une première zone d'un substrat (10) conformément à une relation opérationnelle entre la carte de masque d'ombrage (11) située complètement dans la chambre de déposition sous vide (101A, 101B,… 101N-1, 101N) et une source de matériau de déposition (14) ; B, à déposer le matériau par évaporation sous vide sur la première zone du substrat (10) pour former un motif ; C, à orienter la carte de masque d'ombrage (11) et la source de matériau de déposition (14) avec précision sur une deuxième zone du substrat (10) par engrenages ; D, à déposer le matériau par évaporation sous vide sur la deuxième zone du substrat (10) pour former un motif et pour former un chevauchement tridimensionnel entre les matériaux ; selon la conception, à répéter les étapes C et D pour achever les compositions et connexions des composants ; ensuite, après un recuit dans une chambre de recuit sous vide (102), à essayer dans une chambre d'essai sous vide (103), à découper dans une chambre de découpage sous vide (104) et à assembler dans une chambre d'assemblage sous vide (105) dans cet ordre, et le prototypage et la fabrication des composants complets sont réalisés.
Also published as
CN102122612
Latest bibliographic data on file with the International Bureau
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