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1. WO2012073765 - SEMICONDUCTOR MANUFACTURING APPARATUS

Publication Number WO/2012/073765
Publication Date 07.06.2012
International Application No. PCT/JP2011/076964
International Filing Date 22.11.2011
IPC
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
H01L 21/67242
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
H01L 21/67769
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67769Storage means
H01L 21/67778
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67778involving loading and unloading of waers
Applicants
  • 株式会社日立国際電気 HITACHI KOKUSAI ELECTRIC INC. [JP]/[JP] (AllExceptUS)
  • 相澤 聡 AIZAWA Satoshi [JP]/[JP] (UsOnly)
  • 中嶋 誠世 NAKASHIMA Seiyo [JP]/[JP] (UsOnly)
  • 山田 朋之 YAMADA Tomoyuki [JP]/[JP] (UsOnly)
Inventors
  • 相澤 聡 AIZAWA Satoshi
  • 中嶋 誠世 NAKASHIMA Seiyo
  • 山田 朋之 YAMADA Tomoyuki
Agents
  • ポレール特許業務法人 POLAIRE I.P.C.
Priority Data
2010-26480629.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR MANUFACTURING APPARATUS
(FR) DISPOSITIF DE FABRICATION DE SEMI-CONDUCTEUR
(JA) 半導体製造装置
Abstract
(EN)
A semiconductor manufacturing apparatus is configured so as to comprise: a frame that forms an outer shell of the semiconductor manufacturing apparatus; a load port disposed at the front of the apparatus in order to exchange a substrate container with the exterior of the semiconductor manufacturing apparatus; a substrate container conveyance mechanism disposed in the frame behind the load port; a substrate container storage shelf disposed in the frame and behind the substrate container conveyance mechanism; a first transparent window that constitutes a portion of the front surface of the frame, that is disposed above the load port, and that has a transparent window; and an operation unit that is disposed at the front of the semiconductor manufacturing system and is operated by an operator.
(FR)
L'invention concerne un dispositif de fabrication de semi-conducteur qui est équipé : d'un boîtier formant l'extérieur du dispositif de fabrication de semi-conducteur; d'un port de charge agencé dans la partie avant du dispositif de l'invention afin d'assurer le transfert d'un réceptacle de substrat avec la partie externe dudit dispositif de fabrication de semi-conducteur; d'un mécanisme de transport de réceptacle de substrat agencé à l'intérieur dudit boîtier vers l'arrière dudit port de charge; d'un rayonnage de stockage pour réceptacle de substrat agencé à l'intérieur dudit boîtier vers l'arrière dudit mécanisme de transport de réceptacle de substrat; d'une première partie fenêtre transparente qui configure une partie de la face avant dudit boîtier, qui est agencée au-dessus dudit port de charge, et qui possède une fenêtre transparente; et d'une partie opération qui est agencée sur la partie avant dudit dispositif de fabrication de semi-conducteur, et qui reçoit les opérations effectuées par un opérateur.
(JA)
半導体製造装置の外郭を形成する筐体と、前記半導体製造装置外部との間で基板収容器を受渡すために該装置前部に設けられたロードポートと、前記ロードポートの後方であって前記筐体内に設けられた基板収容器搬送機構と、前記基板収容器搬送機構の後方であって前記筐体内に設けられた基板収容器保管棚と、前記筐体の前面の一部を構成するとともに、前記ロードポートの上方に設けられ、透明窓を有する第1透明窓部と、前記半導体製造装置の前部に設けられ操作員からの操作を受け付ける操作部と、を備えるように半導体製造装置を構成する。
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Latest bibliographic data on file with the International Bureau