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1. WO2012070402 - EPOXY RESIN BASED MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART OR DEVICE PROVIDED WITH ELEMENT SEALED WITH THIS MOLDING MATERIAL

Publication Number WO/2012/070402
Publication Date 31.05.2012
International Application No. PCT/JP2011/076002
International Filing Date 10.11.2011
IPC
C08G 59/62 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
62Alcohols or phenols
C08K 3/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
C08K 5/315 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
16Nitrogen-containing compounds
315Compounds containing carbon-to-nitrogen triple bonds
C08K 5/54 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
54Silicon-containing compounds
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
CPC
C08G 59/621
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
62Alcohols or phenols
621Phenols
C08K 5/315
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
16Nitrogen-containing compounds
315Compounds containing carbon-to-nitrogen triple bonds
C08L 63/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C09J 163/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
H01L 23/293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
293Organic, e.g. plastic
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • 日立化成株式会社 Hitachi Chemical Company, Ltd. [JP]/[JP] (AllExceptUS)
  • 田中 賢治 TANAKA, Kenji [JP]/[JP] (UsOnly)
  • 濱田 光祥 HAMADA, Mitsuyoshi [JP]/[JP] (UsOnly)
  • 古沢 文夫 FURUSAWA, Fumio [JP]/[JP] (UsOnly)
Inventors
  • 田中 賢治 TANAKA, Kenji
  • 濱田 光祥 HAMADA, Mitsuyoshi
  • 古沢 文夫 FURUSAWA, Fumio
Agents
  • 膝舘 祥治 HIZATATE, Shoji
Priority Data
2010-26355826.11.2010JP
2011-24069001.11.2011JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) EPOXY RESIN BASED MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART OR DEVICE PROVIDED WITH ELEMENT SEALED WITH THIS MOLDING MATERIAL
(FR) MATIÈRE DE MOULAGE À BASE DE RÉSINE ÉPOXY POUR SCELLEMENT ÉTANCHE ET PIÈCE OU DISPOSITIF ÉLECTRONIQUE COMPORTANT UN ÉLÉMENT SCELLÉ DE FAÇON ÉTANCHE À L'AIDE DE CETTE MATIÈRE DE MOULAGE
(JA) 封止用エポキシ樹脂成形材料、及びこの成形材料で封止した素子を備えた電子部品装置
Abstract
(EN)
Provided is an epoxy resin based molding material for sealing, said molding material comprising (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a mono- or di-hydric phenol derivative containing one or more nitrile groups in the molecular structure. It is preferable that the content of the mono- or di-hydric phenol derivative (C) is 0.1 to 1.0% by mass. Further, it is preferable that the molding material contains (D) a silane compound, (E) a cure accelerator, and/or (F) an inorganic filler. Also provided is an electronic part or device that is provided with an element sealed with the epoxy resin based molding material.
(FR)
L'invention concerne une matière de moulage à base de résine époxy pour un scellement étanche, ladite matière de moulage comprenant (A) une résine époxy contenant au moins deux groupes époxy dans une molécule, (B) un agent de durcissement et (C) un dérivé de phénol mono- ou divalent contenant au moins un groupe nitrile dans la structure moléculaire. On préfère que la teneur du dérivé de phénol mono- ou divalent (C) soit de 0,1 à 1,0 % en masse. De plus, on préfère que la matière de moulage contienne (D) un composé silane, (E) un accélérateur de durcissement et/ou (F) une charge inorganique. L'invention concerne également une pièce ou un dispositif électronique qui comporte un élément scellé de façon étanche à l'aide de la matière de moulage à base de résine époxy.
(JA)
 (A)1分子中にエポキシ基を2個以上含有するエポキシ樹脂、(B)硬化剤、(C)分子構造中にニトリル基を1個以上含有する1価又は2価のフェノール誘導体を含有する封止用エポキシ樹脂成形材料。(C)分子構造中にニトリル基を1個以上有する1価又は2価のフェノール誘導体の割合が、0.1~1.0質量%であると好ましい。さらに、(D)シラン化合物、(E)硬化促進剤、(F)無機充てん剤を含有すると好ましい。前記の封止用エポキシ樹脂成形材料により封止された素子を備える電子部品装置である。
Also published as
Latest bibliographic data on file with the International Bureau