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1. WO2012070377 - POLYAMIDE RESIN AND METHOD FOR MOLDING SAME

Publication Number WO/2012/070377
Publication Date 31.05.2012
International Application No. PCT/JP2011/075658
International Filing Date 08.11.2011
IPC
C08G 69/26 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
69Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
02Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids
26derived from polyamines and polycarboxylic acids
CPC
C08G 69/26
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
69Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
26derived from polyamines and polycarboxylic acids
C08G 69/265
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
69Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
26derived from polyamines and polycarboxylic acids
265from at least two different diamines or at least two different dicarboxylic acids
C08L 77/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain
06Polyamides derived from polyamines and polycarboxylic acids
Applicants
  • 三菱瓦斯化学株式会社 Mitsubishi Gas Chemical Company, Inc. [JP]/[JP] (AllExceptUS)
  • 小黒 葉月 OGURO Hatsuki [JP]/[JP] (UsOnly)
  • 三田寺 淳 MITADERA Jun [JP]/[JP] (UsOnly)
  • 桑原 久征 KUWAHARA Hisayuki [JP]/[JP] (UsOnly)
Inventors
  • 小黒 葉月 OGURO Hatsuki
  • 三田寺 淳 MITADERA Jun
  • 桑原 久征 KUWAHARA Hisayuki
Agents
  • 特許業務法人特許事務所サイクス SIKs & Co.
Priority Data
2010-26405826.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLYAMIDE RESIN AND METHOD FOR MOLDING SAME
(FR) RÉSINE DE POLYAMIDE ET SON PROCÉDÉ DE MOULAGE
(JA) ポリアミド樹脂およびその成形方法
Abstract
(EN)
Provided is a polyamide resin having high heat resistance, excellent moldability and excellent mechanical properties. A polyamide resin comprising a diamine unit which contains 70 mol% or more of a xylylene diamine unit comprising 50-95 mol% of paraxylylene diamine and 50-5 mol% of metaxylylene diamine and a dicarboxylic acid unit which contains 70 mol% or more of a linear aliphatic dicarboxylic acid unit comprising 50-100 mol% of adipic acid and 0 mol% or greater but less than 50 mol% of sebacic acid or another linear aliphatic carboxylic acid, wherein the polyamide resin is characterized in that the molar ratio of the reacted diamine unit to the reacted dicarboxylic acid unit ((the molar number of the reacted diamine units)/(the molar number of the reacted dicarboxylic acid units)) is less than 0.994 and the polyamide resin has a number average molecular weight of 10,000-25,000 and a melting point of 285˚C or higher.
(FR)
L'invention concerne une résine de polyamide ayant une résistance élevée à la chaleur, une excellente aptitude au moulage et d'excellentes propriétés mécaniques. L'invention concerne une résine de polyamide comprenant une unité diamine qui contient 70 % en moles ou plus d'une unité xylylène diamine comprenant 50-95 % en moles de paraxylylène diamine et 50-5 % en moles de métaxylylène diamine et une unité acide dicarboxylique qui contient 70 % en moles ou plus d'une unité acide dicarboxylique aliphatique linéaire comprenant 50-100 % en moles d'acide adipique et 0 % en moles ou plus mais moins de 50 % en moles d'acide sébacique ou d'un autre acide carboxylique aliphatique linéaire, la résine de polyamide étant caractérisée en ce que le rapport molaire de l'unité diamine ayant réagi à l'unité acide dicarboxylique ayant réagi ((le nombre de moles des unités diamine ayant réagi)/(le nombre de moles des unités acide dicarboxylique ayant réagi)) est inférieur à 0,994 et la résine de polyamide a une masse moléculaire moyenne en nombre de 10 000-25 000 et un point de fusion de 285°C ou plus.
(JA)
 高い耐熱性を有し、成形加工性に優れ、機械物性にも優れたポリアミド樹脂を提供する。 パラキシリレンジアミン50~95モル%、メタキシリレンジアミン50~5モル%からなるキシリレンジアミン単位を70モル%以上含むジアミン単位、アジピン酸50~100モル%、セバシン酸またはその他の直鎖脂肪族カルボン酸0~50モル%未満からなる直鎖脂肪族ジカルボン酸単位を70モル%以上含むジカルボン酸単位からなるポリアミド樹脂であって、 反応したジカルボン酸単位に対する反応したジアミン単位のモル比(反応したジアミン単位のモル数/反応したジカルボン酸単位のモル数)が、0.994未満であり、 数平均分子量が10,000~25,000、融点が285℃以上であることを特徴とするポリアミド樹脂。
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