Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Saturday 31.10.2020 at 7:00 AM CET
Settings

Settings

Goto Application

1. WO2012070336 - CHIP THERMISTOR AND THERMISTOR ASSEMBLY BOARD

Publication Number WO/2012/070336
Publication Date 31.05.2012
International Application No. PCT/JP2011/073962
International Filing Date 18.10.2011
IPC
H01C 7/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
7Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
04having negative temperature coefficient
CPC
H01C 7/008
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
7Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
008Thermistors
H01C 7/021
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
7Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
02having positive temperature coefficient
021formed as one or more layers or coatings
H01C 7/041
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
7Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
04having negative temperature coefficient
041formed as one or more layers or coatings
Applicants
  • TDK株式会社 TDK Corporation [JP]/[JP] (AllExceptUS)
  • 斎藤 洋 SAITO Yo [JP]/[JP] (UsOnly)
  • 山田 孝樹 YAMADA Kouki [JP]/[JP] (UsOnly)
  • 村上 幸弘 MURAKAMI Yukihiro [JP]/[JP] (UsOnly)
Inventors
  • 斎藤 洋 SAITO Yo
  • 山田 孝樹 YAMADA Kouki
  • 村上 幸弘 MURAKAMI Yukihiro
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
Priority Data
2010-26018722.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CHIP THERMISTOR AND THERMISTOR ASSEMBLY BOARD
(FR) THERMISTANCE SOUS FORME DE PUCE ET CARTE D'ENSEMBLE DE THERMISTORS
(JA) チップサーミスタ及びサーミスタ集合基板
Abstract
(EN)
A chip thermistor (1) is provided with a thermistor element (3), a first electrode (5), a second electrode (7) and a third electrode (9). The thermistor element (3) comprises a first main surface (3a) and a second main surface (3b) that face each other in a first direction. The first electrode (5) and the second electrode (7) are arranged on the first main surface (3a) of the thermistor element (3) at a distance from each other in a second direction that is perpendicular to the first direction. The third electrode (9) is arranged on the second main surface (3b) of the thermistor element (3) so as to overlap the first electrode (5) and the second electrode (7) when viewed in the first direction.
(FR)
L'invention concerne une thermistance sous forme de puce (1) qui comprend un élément de thermistance (3), une première électrode (5), une deuxième électrode (7) et une troisième électrode (9). L'élément de thermistance (3) comprend une première surface principale (3a) et une deuxième surface principale (3b) qui se font face dans une première direction. La première électrode (5) et la deuxième électrode (7) sont disposées sur la première surface principale (3a) de l'élément de thermistance (3), à une distance l'une de l'autre dans une seconde direction qui est perpendiculaire à la première direction. La troisième électrode (9) est disposée sur la seconde surface principale (3b) de l'élément de thermistance (3) de manière à être superposée à la première électrode (5) et à la deuxième électrode (7) lorsque l'on observe le tout dans la première direction.
(JA)
 チップサーミスタ1は、サーミスタ素体3と、第一電極5と、第二電極7と、第三電極9と、を備えている。サーミスタ素体3は、第一方向で互いに対向する第一主面3aと第二主面3bを有している。第一電極5と第二電極7とは、サーミスタ素体3の第一主面3aに、第一方向に直交する第二方向に互いに離間して配置されている。第三電極9は、サーミスタ素体3の第二主面3bに、第一方向から見て第一電極5と第二電極7とに重なるように配置されている。
Latest bibliographic data on file with the International Bureau