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1. WO2012069700 - PRINTED WIRING BOARD WITH DIELECTRIC MATERIAL SECTIONS HAVING DIFFERENT DISSIPATION FACTORS

Publication Number WO/2012/069700
Publication Date 31.05.2012
International Application No. PCT/FI2011/051026
International Filing Date 22.11.2011
IPC
H05K 1/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
CPC
H05K 1/165
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
165incorporating printed inductors
H05K 2201/0187
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0183Dielectric layers
0187with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
H05K 3/4691
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
H05K 3/4694
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
4694Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
Applicants
  • NOKIA CORPORATION [FI]/[FI] (AllExceptUS)
  • NIEMI, Ian [FI]/[FI] (UsOnly)
  • KARTIO, Ilkka [FI]/[FI] (UsOnly)
  • PERÄLÄ, Kimmo [FI]/[FI] (UsOnly)
  • VIRTANEN, Kari [FI]/[FI] (UsOnly)
  • VENTOMÄKI, Hannu [FI]/[FI] (UsOnly)
Inventors
  • NIEMI, Ian
  • KARTIO, Ilkka
  • PERÄLÄ, Kimmo
  • VIRTANEN, Kari
  • VENTOMÄKI, Hannu
Agents
  • NOKIA CORPORATION
Priority Data
12/954,00124.11.2010US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PRINTED WIRING BOARD WITH DIELECTRIC MATERIAL SECTIONS HAVING DIFFERENT DISSIPATION FACTORS
(FR) CARTE DE CÂBLAGE IMPRIMÉE DOTÉE DE SECTIONS DE MATÉRIAU DIÉLECTRIQUE AYANT DES FACTEURS DE DISSIPATION DIFFÉRENTS
Abstract
(EN)
An apparatus including a first printed wiring board section (28) and a second printed wiring board section (30). The first printed wiring board section (28) includes a first dielectric material layer. The first dielectric material layer has a first dissipation factor. The second printed wiring board section (30) is directly attached with the first printed wiring board section (28) to form a unitary printed wiring board structure (15). The second printed wiring board section (30) includes a second dielectric material layer and an antenna (36) on the second dielectric material layer. The second dielectric material layer has a different second dissipation factor.
(FR)
L'invention porte sur un appareil, qui comprend une première section de carte de câblage imprimée (28) et une seconde section de carte de câblage imprimée (30). La première section de carte de câblage imprimée (28) comprend une première couche de matériau diélectrique. La première couche de matériau diélectrique a un premier facteur de dissipation. La seconde section de carte de câblage imprimée (30) est directement fixée à la première section de carte de câblage imprimée (28) pour former une structure de carte de câblage (15) imprimée de façon unitaire. La seconde section de carte de câblage imprimée (30) comprend une seconde couche de matériau diélectrique et une antenne (36) sur la seconde couche de matériau diélectrique. La seconde couche de matériau diélectrique a un second facteur de dissipation différent.
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