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1. WO2012067945 - INTEGRATED MODULE FOR USE IN NETWORK CONNECTIVITY

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[ EN ]

What is claimed is:

Claims

1. An apparatus comprising:

an integrated module that includes a physical layer network device and a cable connector receptacle, the physical layer network device being physically and electrically coupled to the cable connector receptacle, the physical layer network device including a circuit board, the circuit board being directly physically coupled to the receptacle, the circuit board also being electrically coupled to the receptacle.

2. The apparatus of claim 1, wherein:

the integrated module further comprises a physical layer isolation module that electrically couples the circuit board to the receptacle, the isolation module being physically mounted both to the receptacle and to the circuit board.

3. The apparatus of claim 2, wherein:

the circuit board includes a first integrated circuit chipset and a lead frame, the first chipset being to perform, at least in part, one or more physical layer network operations, the lead frame being to electrically couple the first chipset to a second integrated circuit chipset via at least one board-level interconnect.

4. The apparatus of claim 3, wherein:

the second integrated circuit chipset is mounted to a motherboard that includes, at least in part, the at least one interconnect;

the receptacle comprises an RJ45 connector; and

the at least one interconnect comprises a peripheral component interconnect express interconnect.

5. The apparatus of claim 1, wherein:

the receptacle includes an opening to receive a connector jack and an external surface, the circuit board having a first surface and a second surface, the first surface being opposite to the second surface, the first surface being physically mounted to and in

intimate contact with the external surface, an integrated circuit chipset being mounted to the first surface; and

the integrated module includes a physical layer isolation module that is physically mounted to and in intimate contact with the second surface.

6. The apparatus of claim 1, wherein:

the receptacle includes an opening to receive a connector jack and also includes an external surface, the circuit board having a first surface and a second surface, the first surface being opposite to the second surface, the circuit board including an integrated circuit chipset that is mounted to the first surface, the circuit board being mounted to the external surface so as to extend at an angle from the external surface; and

the integrated module includes a physical layer isolation module that is physically mounted to and in intimate contact with the second surface.

7. An apparatus comprising:

an integrated module that includes a physical layer network device and a cable connector receptacle, the physical layer network device being physically and electrically coupled to the cable connector receptacle, the physical layer network device including a circuit board that includes a first surface, the receptacle including a second surface, and the first surface being mounted to the second surface such that the first surface covers the second surface.

8. The apparatus of claim 7, wherein:

the first surface and the second surface have identical dimensions; and the first surface entirely covers the second surface.

9. The apparatus of claim 7, wherein:

the first surface is undersized compared to the second surface.

10. An apparatus comprising:

an integrated module that includes a physical layer isolation module and a physical layer network device, the physical layer isolation module including a first surface, the physical layer network device including a circuit board that includes a second surface, the first surface being mounted to the second surface such that the first surface covers the second surface.

1 1. The apparatus of claim 10, wherein:

the first surface is undersized compared to the second surface.

12. The apparatus of claim 10, wherein:

the apparatus also comprises a cable connector receptacle having a third surface; the circuit board includes a fourth surface; and

the fourth surface being mounted to the third surface such that the fourth surface covers the third surface.

13. The apparatus of claim 12, wherein:

the third surface and the fourth surface have identical dimensions; and

the fourth surface entirely covers the third surface.

14. The apparatus of claim 12, wherein:

the fourth surface is undersized compared to the third surface.

15. The apparatus of claim 12, wherein:

the circuit board also comprises a lead frame coupled to the physical layer isolation module and to be coupled to an integrated circuit chipset via at least one board-level interconnect.