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1. WO2012067016 - CONDUCTIVE PASTE AND BASE WITH CONDUCTIVE FILM

Publication Number WO/2012/067016
Publication Date 24.05.2012
International Application No. PCT/JP2011/075962
International Filing Date 10.11.2011
IPC
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
C08L 39/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
39Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
04Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
06Homopolymers or copolymers of N-vinyl-pyrrolidones
C08L 61/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
61Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
04Condensation polymers of aldehydes or ketones with phenols only
C08L 79/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
02Polyamines
H01B 1/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H05K 1/09 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
C08G 73/0206
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
02Polyamines
0206Polyalkylene(poly)amines
C08K 13/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
13Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
04Ingredients characterised by their shape and organic or inorganic ingredients
C08K 3/11
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
10Metal compounds
11Compounds containing metals of Groups 4 to 10 or Groups 14 to 16 of the Periodic system
C08L 39/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
39Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
04Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
06Homopolymers or copolymers of N-vinyl-pyrrolidones
C09D 161/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
161Coating compositions based on condensation polymers of aldehydes or ketones
04Condensation polymers of aldehydes or ketones with phenols only
C09D 179/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
179Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
02Polyamines
Applicants
  • 旭硝子株式会社 Asahi Glass Company, Limited [JP]/[JP] (AllExceptUS)
  • 平社 英之 HIRAKOSO Hideyuki [JP]/[JP] (UsOnly)
  • 諏訪 久美子 SUWA Kumiko [JP]/[JP] (UsOnly)
Inventors
  • 平社 英之 HIRAKOSO Hideyuki
  • 諏訪 久美子 SUWA Kumiko
Agents
  • 小栗 昌平 OGURI Shohei
Priority Data
2010-25565216.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CONDUCTIVE PASTE AND BASE WITH CONDUCTIVE FILM
(FR) PÂTE CONDUCTRICE ET BASE AYANT UN FILM CONDUCTEUR
(JA) 導電性ペーストおよび導電膜付き基材
Abstract
(EN)
Provided is a conductive paste which exhibits good adhesion by merely being applied over an ITO film directly without the formation of a base layer and being cured thereon and is capable of forming a conductive film that has high conductivity. This conductive paste contains (A) copper particles having an average particle diameter from 10 nm to 20 μm, (B) a carboxylic acid salt of a polymer compound that has at least one primary amino group in each molecule (provided that the carboxylic acid has 10 or less carbon atoms including the carbon atoms of the carbonyl group) and (C) a resin that has an acidic functional group that is reactive with the primary amino group. Specifically, the polymer compound that has primary amino group(s) is preferably a polyethylene imine or a polyallyl amine. In addition, the carboxylic acid salt thereof is preferably a formic acid salt.
(FR)
L'invention concerne une pâte conductrice qui présente une bonne adhésion en étant simplement appliquée sur un film d'oxyde d'étain et d'indium (ITO) directement sans la formation d'une couche de base et étant durcie sur celui-ci et qui est apte à former un film conducteur qui a une conductivité élevée. Cette pâte conductrice contient (A) des particules de cuivre ayant un diamètre moyen de particule de 10 nm à 20 µm, (B) un sel d'acide carboxylique d'un composé polymère qui a au moins un groupe amino primaire dans chaque molécule (à la condition que l'acide carboxylique ait 10 atomes de carbone ou moins comprenant les atomes de carbone du groupe carbonyle) et (C) une résine qui a un groupe fonctionnel acide qui est apte à réagir avec le groupe amino primaire. De manière spécifique, le composé polymère qui a un (des) groupe(s) amino primaire(s) est, de préférence, un polyéthylène imine ou une polyallyl amine. De plus, le sel d'acide carboxylique de celui-ci est, de préférence, un sel d'acide formique.
(JA)
 ITO膜上に下地層を形成することなく直接塗布して硬化させるだけで良好な密着性を発現し、導電性が高い導電膜を形成することができる導電性ペーストを提供する。この導電性ペーストは、(A)平均粒子径が10nm~20μmの銅粒子と、(B)分子中に少なくとも1個の1級アミノ基を有する高分子化合物のカルボン酸塩(カルボン酸は、カルボニル基の炭素を含めた炭素数が10以下)と、(C)前記1級アミノ基と反応可能な酸性官能基を有する樹脂とを含有する。1級アミノ基を有する高分子化合物は、具体的にはポリエチレンイミンまたはポリアリルアミンであることが好ましい。また、そのカルボン酸塩は、ギ酸塩であることが好ましい。
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