Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Saturday 31.10.2020 at 7:00 AM CET
Settings

Settings

Goto Application

1. WO2012066465 - SOLDERING CONNECTION WITH A WETTING AND NON-WETTING METAL LAYER

Publication Number WO/2012/066465
Publication Date 24.05.2012
International Application No. PCT/IB2011/055072
International Filing Date 14.11.2011
IPC
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
CPC
H05K 1/111
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
111Pads for surface mounting, e.g. lay-out
H05K 2201/2081
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
2081Compound repelling a metal, e.g. solder
H05K 2203/048
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
04Soldering or other types of metallurgic bonding
048Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
Y02P 70/50
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
70Climate change mitigation technologies in the production process for final industrial or consumer products
50Manufacturing or production processes characterised by the final manufactured product
Applicants
  • KONINKLIJKE PHILIPS ELECTRONICS N.V. [NL]/[NL] (AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BE, BF, BG, BH, BJ, BR, BW, BY, BZ, CA, CF, CG, CH, CI, CL, CM, CN, CO, CR, CU, CY, CZ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, FR, GA, GB, GD, GE, GH, GM, GN, GQ, GR, GT, GW, HN, HR, HU, ID, IE, IL, IN, IS, IT, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MC, MD, ME, MG, MK, ML, MN, MR, MT, MW, MX, MY, MZ, NA, NE, NG, NI, NL, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SI, SK, SL, SM, SN, ST, SV, SY, SZ, TD, TG, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, ZA, ZM, ZW)
  • PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH [DE]/[DE] (DE)
  • DUMOULIN, Raimond, Louis [NL]/[NL] (UsOnly)
  • ELGER, Gordon, Patrick, Rudolf [DE]/[DE] (UsOnly)
  • GIJSBERS, Hendrik, Elisabeth, Jozef [NL]/[NL] (UsOnly)
  • CAERS, Johan, Frans, Justin, Maria [BE]/[BE] (UsOnly)
  • ZHAO, Xiu, Juan [CN]/[NL] (UsOnly)
  • DE JONG, Adrianus, Marinus [NL]/[NL] (UsOnly)
Inventors
  • DUMOULIN, Raimond, Louis
  • ELGER, Gordon, Patrick, Rudolf
  • GIJSBERS, Hendrik, Elisabeth, Jozef
  • CAERS, Johan, Frans, Justin, Maria
  • ZHAO, Xiu, Juan
  • DE JONG, Adrianus, Marinus
Agents
  • VAN EEUWIJK, Alexander
Priority Data
10191895.119.11.2010EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SOLDERING CONNECTION WITH A WETTING AND NON-WETTING METAL LAYER
(FR) CONNEXION SOUDÉE COMPORTANT UNE COUCHE MÉTALLIQUE MOUILLABLE ET NON MOUILLABLE
Abstract
(EN)
An assembly includes a substrate (10) with a first covering layer (20) and a second covering layer (22). The first covering layer (20) is made from a metal material that is non-wetting for a solder material. The second covering layer (22) is made from a metal material that is wetting for the solder material (30). A cut-out (26) is formed in the second layer (22) forming a solder dam (26) delimiting a soldering pad (24). A component (12) is fixed to the substrate (10) by a soldering connection formed by the solder material (30) between the soldering pad (24) and the component (12).
(FR)
L'invention concerne un ensemble comprenant un substrat (10) comportant une première couche de couverture (20) et une seconde couche de couverture (22). La première couche de couverture (20) est faite dans un matériau métallique qui ne peut pas être mouillé par un matériau de soudure. La seconde couche de couverture (22) est faite dans un matériau métallique qui peut être mouillé par le matériau de soudure (30). Une découpe (26) est formée dans la seconde couche (22) pour former une digue de soudure (26) qui délimite une pastille de soudage (24). Un composant (12) est fixé sur le substrat (10) par une connexion soudée formée par le matériau de soudure (30) entre la pastille de soudage (24) et le composant (12).
Latest bibliographic data on file with the International Bureau