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1. WO2012065363 - BRIGHTNESS-ADJUSTABLE LIGHT EMITTING DEVICE, ARRAY AND MANUFACTURING METHOD THEREOF

Publication Number WO/2012/065363
Publication Date 24.05.2012
International Application No. PCT/CN2011/001908
International Filing Date 15.11.2011
IPC
H01L 27/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H01L 33/00 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
CPC
G03B 21/2033
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
21Projectors or projection-type viewers; Accessories therefor
14Details
20Lamp housings
2006characterised by the light source
2033LED or laser light sources
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • 复旦大学 FUDAN UNIVERSITY [CN]/[CN] (AllExceptUS)
  • 王鹏飞 WANG, Pengfei [CN]/[CN] (UsOnly)
  • 林曦 LIN, Xi [CN]/[CN] (UsOnly)
  • 刘昕彦 LIU, Xinyan [CN]/[CN] (UsOnly)
  • 张卫 ZHANG, Wei [CN]/[CN] (UsOnly)
Inventors
  • 王鹏飞 WANG, Pengfei
  • 林曦 LIN, Xi
  • 刘昕彦 LIU, Xinyan
  • 张卫 ZHANG, Wei
Agents
  • 中国商标专利事务所有限公司 CHINA TRADEMARK & PATENT LAW OFFICE CO., LTD.
Priority Data
201010545127.316.11.2010CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) BRIGHTNESS-ADJUSTABLE LIGHT EMITTING DEVICE, ARRAY AND MANUFACTURING METHOD THEREOF
(FR) SEMI-CONDUCTEUR À LUMINOSITÉ RÉGLABLE, MATRICE ET SON PROCÉDÉ DE FABRICATION
(ZH) 一种亮度可调的发光器件、阵列及其制造方法
Abstract
(EN)
The present invention belongs to the technical field of semiconductor devices, and particularly disclosed are a brightness-adjustable light emitting device, an array and a manufacturing method thereof. The light emitting device comprises a semiconductor substrate, and a MOSFET and a light emitting diode located on the semiconductor substrate. The light emitting diode (LED) and the control element (MOSFET) thereof are integrated on the same chip, enabling a single chip to emit an image. An array of light emitting devices can also be formed by a plurality of the light emitting devices. At the same time, a manufacturing method for the light emitting device is also disclosed. A projecting device manufactured from the light emitting device provided in the present invention has the advantages of small volume, portability and low power consumption, etc. In addition, the use of the integrated circuit chip enables a significant simplification of the projecting device system, reducing production costs and improving greatly its pixels and brightness.
(FR)
L'invention se rapporte au domaine technique des semi-conducteurs et concerne, plus particulièrement, un dispositif électroluminescent à luminosité réglable, une matrice et son procédé de fabrication. Ce dispositif électroluminescent comprend un substrat de semi-conducteur, un MOSFET placé sur le substrat de semi-conducteur et une diode électroluminescente (LED). La LED et son composant de commande (MOSFET) sont intégrés sur la même puce de telle sorte que la puce puisse transmettre une image. Une pluralité de dispositifs électroluminescents peuvent aussi former la matrice du dispositif électroluminescent. L'invention concerne aussi un procédé de fabrication de ce dispositif électroluminescent. L'équipement de projection formé par le dispositif électroluminescent de cette invention est caractérisé en ce qu'il est compact, portatif et à faible consommation d'énergie. De plus, la puce du circuit intégré simplifie considérablement l'équipement, réduit les coûts tout en augmentant sensiblement les pixels et la luminosité.
(ZH)
本发明属于半导体器件技术领域,具体公开了一种亮度可调的发光器件、阵列及其制造方法。所述发光器件包括一个半导体衬底、位于所述半导体衬底之上的MOSFET和发光二极管。发光二极管(LED)及其控制元件(MOSFET)集成在同一个芯片上,使单个芯片就可以实现图像的发射。由多个所述的发光器件还可以构成发光器件阵列。同时,本发明还公开了所述发光器件的制造方法。采用本发明所提出的发光器件制造的投影设备具有体积小、可便携性、功耗低等优点,而且,集成电路芯片的使用,使得投影设备系统大大简化,降低了生产成本,并且可以大大提高像素及亮度。
Also published as
Latest bibliographic data on file with the International Bureau