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1. WO2012063459 - LIGHT EMITTING DIODE MODULE AND CERAMIC SUBSTRATE USED THEREIN

Publication Number WO/2012/063459
Publication Date 18.05.2012
International Application No. PCT/JP2011/006209
International Filing Date 07.11.2011
IPC
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
CPC
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
H01L 2924/09701
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
095with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
097Glass-ceramics, e.g. devitrified glass
09701Low temperature co-fired ceramic [LTCC]
H01L 33/486
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
483Containers
486adapted for surface mounting
H01L 33/60
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
58Optical field-shaping elements
60Reflective elements
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applicants
  • パナソニック株式会社 PANASONIC CORPORATION [JP]/[JP] (AllExceptUS)
  • 森田 敏文 MORITA, Toshifumi (UsOnly)
Inventors
  • 森田 敏文 MORITA, Toshifumi
Agents
  • 田中 光雄 TANAKA, Mitsuo
Priority Data
2010-24930108.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIGHT EMITTING DIODE MODULE AND CERAMIC SUBSTRATE USED THEREIN
(FR) MODULE DE DIODE ÉLECTROLUMINESCENTE ET SUBSTRAT CÉRAMIQUE UTILISÉ DANS CELUI-CI
(JA) 発光ダイオードモジュールおよびそれに用いられるセラミック基板
Abstract
(EN)
This light emitting diode module is provided with: a ceramic substrate part; a light emitting diode which is connected to a main surface of the ceramic substrate part; and an optical element which is provided so as to cover the light emitting diode on the main surface of the ceramic substrate part. Specifically, this light emitting diode module is additionally provided with an ESD protection element which is connected to the main surface of the ceramic substrate part. The ESD protection element is arranged in an empty space that is formed between the main surface of the ceramic substrate part and the light emitting diode in such a manner that the ESD protection element is covered with the light emitting diode.
(FR)
La présente invention concerne un module de diode électroluminescente équipé d'une partie substrat céramique ; d'une diode électroluminescente qui est connectée à une surface principale de la partie substrat céramique ; et d'un élément optique qui est formé de façon à recouvrir la diode électroluminescente sur la surface principale de la partie substrat céramique. En particulier, ce module de diode électroluminescente est en outre doté d'un élément de protection ESD qui est connecté à la surface principale de la partie substrat céramique. L'élément de protection ESD est disposé dans un espace vide qui est formé entre la surface principale de la partie substrat céramique et la diode électroluminescente de telle sorte que l'élément de protection ESD soit recouvert de la diode électroluminescente.
(JA)
 本発明の発光ダイオードモジュールは、セラミック基板部、そのセラミック基板部の主面に接続された発光ダイオード、および、セラミック基板部の主面上にて発光ダイオードを覆うように設けられた光学系素子を有して成る。特に、本発明の発光ダイオードモジュールは、セラミック基板部の主面に接続されたESD保護素子を更に有して成り、そのESD保護素子が、発光ダイオードによって覆われるような形態でもって、セラミック基板部の主面と発光ダイオードとの間に形成された隙間部に配置されている。
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