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1. WO2012063386 - PRODUCTION METHOD FOR SOLDER TRANSFER BASE MATERIAL, SOLDER PRECOATING METHOD, AND SOLDER TRANSFER BASE MATERIAL

Publication Number WO/2012/063386
Publication Date 18.05.2012
International Application No. PCT/JP2011/004731
International Filing Date 25.08.2011
IPC
B23K 1/20 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
B23K 3/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 3/24 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing of the conductive pattern
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
CPC
B23K 1/0016
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
0008specially adapted for particular articles or work
0016Brazing of electronic components
B23K 1/20
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 1/203
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
203Fluxing, i.e. applying flux onto surfaces
B23K 1/206
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
206Cleaning
B23K 2101/42
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
42Printed circuits
B23K 3/0607
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0607Solder feeding devices
Applicants
  • パナソニック株式会社 PANASONIC CORPORATION [JP]/[JP] (AllExceptUS)
  • 櫻井 大輔 SAKURAI, Daisuke (UsOnly)
Inventors
  • 櫻井 大輔 SAKURAI, Daisuke
Agents
  • 特許業務法人 松田国際特許事務所 TOKKYOGYOMUHOUJIN MATSUDAKOKUSAITOKKYOJIMUSYO
Priority Data
2010-24957608.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PRODUCTION METHOD FOR SOLDER TRANSFER BASE MATERIAL, SOLDER PRECOATING METHOD, AND SOLDER TRANSFER BASE MATERIAL
(FR) PROCÉDÉ DE PRODUCTION POUR MATÉRIAU DE BASE DE TRANSFERT DE SOUDURE, PROCÉDÉ DE PRÉ-ENROBAGE DE SOUDURE, ET MATÉRIAU DE BASE DE TRANSFERT DE SOUDURE
(JA) はんだ転写基材の製造方法、はんだプリコート方法、及びはんだ転写基材
Abstract
(EN)
Provided is a production method for a solder transfer base material which makes forming a solder layer with a thickness that is appropriate for the electronic part or circuit board. The production method is provided with: an adhesive layer forming process, in which an adhesive layer (2) is formed on the surface of a base material; a solder layer forming process, in which a solder layer is formed by positioning a plurality of solder powder bodies (3) in such a way that openings are formed between the solder powder bodies; and a filler supplying process in which fillers (4) are supplied between the solder powder into the openings formed on the adhesive layer.
(FR)
L'invention concerne un procédé de production pour un matériau de base de transfert de soudure qui permet la formation d'une couche de soudure ayant une épaisseur qui est adaptée pour la pièce électronique ou la carte de circuit imprimé. Le procédé de production comporte : un processus de formation de couche adhésive, permettant la formation d'une couche adhésive (2) sur la surface d'un matériau de base ; un processus de formation de couche de soudure, permettant la formation d'une couche de soudure en positionnant une pluralité de corps de poudre de soudure (3) d'une telle manière que les ouvertures sont formées entre les corps de poudre de soudure ; et un processus d'alimentation en produits d'apport permettant d'alimenter des produits d'apport (4) entre la poudre de soudure dans les ouvertures formées sur la couche adhésive.
(JA)
 脆弱な誘電膜を有する半導体素子の脆弱な誘電膜を破壊することなく、電子部品や回路基板に対して適切な厚さのはんだ層を確実に形成できる、はんだ転写基材の製造方法を提供する。 基材表面に粘着層(2)を形成する粘着層形成工程と、粘着層上に、隙間を有するように複数のはんだ粉(3)を搭載してはんだ層を形成するはんだ層形成工程と、粘着層上に形成したはんだ粉の隙間にフィラー(4)を供給するフィラー供給工程とを備える。
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