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1. (WO2012061091) ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF MANUFACTURING SAID MICROELECTRONIC PACKAGE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/061091 International Application No.: PCT/US2011/057594
Publication Date: 10.05.2012 International Filing Date: 25.10.2011
IPC:
H01L 23/28 (2006.01) ,H01L 23/48 (2006.01) ,H01L 21/56 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, CA 95052, US (AllExceptUS)
GUZEK, John S. [US/US]; US (UsOnly)
SANKMAN, Robert L. [US/US]; US (UsOnly)
ICHIKAWA, Kinya [JP/JP]; JP (UsOnly)
TOMITA, Yoshihiro [JP/JP]; JP (UsOnly)
KUBOTA, Jiro [JP/JP]; JP (UsOnly)
Inventors:
GUZEK, John S.; US
SANKMAN, Robert L.; US
ICHIKAWA, Kinya; JP
TOMITA, Yoshihiro; JP
KUBOTA, Jiro; JP
Agent:
VINCENT, Lester J.; Blakely Sokoloff Taylor & Zafman 1279 Oakmead Parkway Sunnyvale, CA 94085, US
Priority Data:
12/940,44605.11.2010US
Title (EN) ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF MANUFACTURING SAID MICROELECTRONIC PACKAGE
(FR) PUCE ENCAPSULÉE, BOÎTIER MICROÉLECTRONIQUE LA CONTENANT ET PROCÉDÉ DE FABRICATION DUDIT BOÎTIER MICROÉLECTRONIQUE
Abstract:
(EN) An encapsulated die (100, 401) comprises a substrate (110, 510) having a first surface (111), an opposing second surface (112), and intervening side surfaces (113), with active devices located at the first surface of the substrate. The active devices are connected by a plurality of electrically conductive layers (120, 520) that are separated from each other by a plurality of electrically insulating layers (125, 525). A protective cap (130, 530) is located over the first surface of the substrate contains an interconnect structure (140) exposed at a surface (131) thereof. In another embodiment, a microelectronic package (200) comprises a package substrate (250) with an encapsulated die (100) such as was described above embedded therein.
(FR) L'invention porte sur une puce encapsulée (100, 401) qui comporte un substrat (110, 510) ayant une première surface (111), une seconde surface opposée (112) et des surfaces latérales intermédiaires (113), des dispositifs actifs étant placés sur la première surface du substrat. Les dispositifs actifs sont connectés par une pluralité de couches électriquement conductrices (120, 520) qui sont séparées les unes des autres par une pluralité de couches électriquement isolantes (125, 525). Un capuchon de protection (130, 530) est placé sur la première surface du substrat et contient une structure d'interconnexion (140) exposée au niveau d'une surface (131) de celui-ci. Selon un autre mode de réalisation, un boîtier microélectronique (200) comporte un substrat de boîtier (250) ayant une puce encapsulée (100), telle que celle décrite ci-dessus, incorporée dans celui-ci.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP2636063CN103201833KR1020130094336CN106340497EP3144966