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1. WO2012060576 - METHOD FOR PROCESSING A NANO FINE ELECTRODE WITHIN A BIOCHEMICAL ANALYSIS CHIP

Publication Number WO/2012/060576
Publication Date 10.05.2012
International Application No. PCT/KR2011/008084
International Filing Date 27.10.2011
IPC
B23K 26/36 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
G01N 27/327 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
27Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means
26by investigating electrochemical variables; by using electrolysis or electrophoresis
28Electrolytic cell components
30Electrodes, e.g. test electrodes; Half-cells
327Biochemical electrodes
G01N 33/48 2006.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
33Investigating or analysing materials by specific methods not covered by groups G01N1/-G01N31/131
48Biological material, e.g. blood, urine; Haemocytometers
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
CPC
B23K 2103/56
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
56semiconducting
B23K 26/0006
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
0006taking account of the properties of the material involved
B23K 26/0624
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0622by shaping pulses
0624using ultrashort pulses, i.e. pulses of 1ns or less
B23K 26/53
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Applicants
  • 이상현 LEE, Sanghyun [KR]/[KR]
Inventors
  • 이상현 LEE, Sanghyun
Agents
  • 정인규 JUNG, Ingyu
Priority Data
10-2010-010800802.11.2010KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) METHOD FOR PROCESSING A NANO FINE ELECTRODE WITHIN A BIOCHEMICAL ANALYSIS CHIP
(FR) PROCÉDÉ POUR TRAITER UNE ÉLECTRODE NANOFINE À L'INTÉRIEUR D'UNE PUCE D'ANALYSE BIOCHIMIQUE
(KO) 생화학 분석칩 내부의 나노 미세전극 가공방법
Abstract
(EN)
The present invention relates to a method for processing a nano fine electrode within a biochemical analysis chip. More particularly, a metal pattern is formed within a mother material, and then the mother material and the metal pattern are processed at the same time using a femtosecond laser to precisely and finely form a fine electrode in a fine channel. Also, only the metal pattern is additionally processed through a femtosecond laser nano surface processing method to obtain a more precise metal pattern on a nano scale level. As a result, a nano scale fine electrode having a size less than about 100 nanometers may be obtained. Also, accuracy of a nanometer level between the fine electrode and the fine channel may be secured, and the processing process may be simplified.
(FR)
La présente invention porte sur un procédé pour traiter une électrode nanofine à l'intérieur d'une puce d'analyse biochimique. Plus particulièrement, un motif métallique est formé à l'intérieur d'un matériau mère, après quoi le matériau mère et le motif métallique sont traités en même temps à l'aide d'un laser femtoseconde afin de former avec précision et de façon fine une électrode fine dans un canal fin. Egalement, le seul motif métallique est additionnellement traité à l'aide d'un procédé de nano-traitement de surface à laser femtoseconde afin d'obtenir un motif métallique plus précis à un niveau d'échelle nanométrique. En résultat, une fine électrode d'échelle nanométrique ayant une taille inférieure à environ 100 nanomètres peut être obtenue. Egalement, une précision d'un niveau nanométrique entre la fine électrode et le canal fin peut être assurée, et le procédé de traitement peut être simplifié.
(KO)
본 발명은 생화학 분석칩 내부의 나노 미세전극 가공방법에 관한 것이다. 보다 상세하게는 모재 내부에 금속패턴을 형성하고 팸토초 레이저를 이용하여 모재와 금속패턴을 동시에 가공함으로써, 미세전극이 미세채널에 정확하고 정교하게 형성될 수 있도록 하며, 금속패턴만을 펨토초 레이저 나노표면 가공법으로 추가 가공함으로써 더욱 정교한 나노 스케일 수준의 금속패턴을 얻을 수 있고 이를 통해 100 나노미터 이하의 나노 스케일 미세전극을 얻을 수 있으며 미세전극과 미체채널 간 나노미터 수준의 정확도를 확보할 수 있을 뿐만 아니라 가공 프로세스를 간결화할 수 있는 생화학 분석칩 내부의 나노 미세전극 가공방법에 관한 것이다.
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