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1. WO2012060545 - LED ARRAY MODULE AND MANUFACTURING METHOD THEREOF

Publication Number WO/2012/060545
Publication Date 10.05.2012
International Application No. PCT/KR2011/006287
International Filing Date 25.08.2011
IPC
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/64 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
H01L 33/62 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
CPC
H01L 33/64
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
H01L 33/648
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
648the elements comprising fluids, e.g. heat-pipes
H05K 1/0203
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
H05K 1/053
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated ; conductive substrates, e.g. insulated; metal substrate
053the metal substrate being covered by an inorganic insulating layer
H05K 2201/017
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
017Glass ceramic coating, e.g. formed on inorganic substrate
H05K 2201/064
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
06Thermal details
064Fluid cooling, e.g. by integral pipes
Applicants
  • 주식회사 신우테크 SHINWOO TECH CO., LTD. [KR]/[KR] (AllExceptUS)
  • 한국세라믹기술원 KOREA INSTITUTE OF CERAMIC ENG. & TECH. [KR]/[KR] (AllExceptUS)
  • 김효태 KIM, Hyo Tae [KR]/[KR] (UsOnly)
  • 송기석 SONG, Gi Seok [KR]/[KR] (UsOnly)
  • 김흥순 KIM, Heung Soon [KR]/[KR] (UsOnly)
Inventors
  • 김효태 KIM, Hyo Tae
  • 송기석 SONG, Gi Seok
  • 김흥순 KIM, Heung Soon
Agents
  • 이훈 LEE, Hoon
Priority Data
10-2010-010809902.11.2010KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) LED ARRAY MODULE AND MANUFACTURING METHOD THEREOF
(FR) MODULE COMPORTANT UN RÉSEAU DE DEL ET PROCÉDÉ DE FABRICATION CORRESPONDANT
(KO) LED 어레이 모듈 및 이의 제조방법
Abstract
(EN)
The present invention provides an LED array module having an improved heat-dissipating effect, and a manufacturing method thereof. To this end, an LED array module includes one or more LED unit modules, the LED unit module comprising: an LED; a heat conductive heat-dissipating slug attached to the lower portion of the LED; and leads connected to the cathode and anode of the LED, respectively, wherein the LED array module comprises: a heat-dissipating plate; a heat conductive solder layer disposed and bonded between the upper surface of the heat-dissipating plate and the lower surface of the heat-dissipating slug; a first insulating layer formed on the upper surface of the heat-dissipating plate; and array electrodes which are formed on the upper surface of the insulating layer and are electrically connected to the leads to drive the LED.
(FR)
La présente invention concerne un module comportant un réseau de DEL qui présente un effet de dissipation thermique amélioré, ainsi qu'un procédé de fabrication correspondant. À cet effet, un module comportant un réseau de DEL comprend un ou plusieurs modules de DEL unitaires, le module de DEL unitaire comprenant : une DEL ; une patte thermoconductrice de dissipation thermique fixée sur la partie inférieure de la DEL ; et des conducteurs qui sont connectés à la cathode et à l'anode de la DEL, respectivement. Le module comportant un réseau de DEL comprend : une plaque de dissipation thermique ; une couche de soudure thermoconductrice placée et collée entre la surface supérieure de la plaque de dissipation thermique et la surface inférieure de la patte de dissipation thermique ; une première couche isolante formée sur la surface supérieure de la plaque de dissipation thermique ; et des électrodes en réseau qui sont formées sur la surface supérieure de la couche isolante et qui sont connectées électriquement aux fils qui attaquent la DEL.
(KO)
본 발명에서는 방열효과가 개선된 LED 어레이 모듈 및 이의 제조방법이 개시된다. 이를 위하여, LED와, 이의 저부에 부착된 열전도성의 방열 슬러그와, 상기 LED의 캐소드 및 애노드에 각각 연결된 리드를 포함한 하나 이상의 LED 단위모듈을 포함하는 LED 어레이 모듈에 있어서, 방열판과, 상기 방열판 상면과 상기 방열 슬러그 저면 사이에 접합 배치된 열전도성의 솔더층과, 상기 방열판 상면에 형성된 제1절연층과, 상기 절연층 상면에 형성되고 상기 리드와 전기적으로 연결되어 상기 LED를 구동하는 어레이 전극을 포함한다.
Also published as
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