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1. WO2012060424 - GAS-BARRIER LAMINATE FILM

Publication Number WO/2012/060424
Publication Date 10.05.2012
International Application No. PCT/JP2011/075339
International Filing Date 02.11.2011
IPC
B32B 9/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
9Layered products essentially comprising a particular substance not covered by groups B32B11/-B32B29/137
C23C 14/06 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
C23C 16/30 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
22characterised by the deposition of inorganic material, other than metallic material
30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
CPC
C23C 14/10
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
10Glass or silica
C23C 16/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
22characterised by the deposition of inorganic material, other than metallic material
30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
H05K 5/0213
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
02Details
0213Thermal insulation; Venting means; Condensation eliminators
Y10T 428/24975
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
24Structurally defined web or sheet [e.g., overall dimension, etc.]
24942including components having same physical characteristic in differing degree
2495Thickness [relative or absolute]
24967Absolute thicknesses specified
24975No layer or component greater than 5 mils thick
Applicants
  • 三菱樹脂株式会社 MITSUBISHI PLASTICS, INC. [JP]/[JP] (AllExceptUS)
  • 山内 康嗣 YAMAUCHI, Koji [JP]/[JP] (UsOnly)
  • 吉田 重信 YOSHIDA, Shigenobu [JP]/[JP] (UsOnly)
  • 蜂須賀 亨 HACHISUKA, Tooru [JP]/[JP] (UsOnly)
  • 木村 繁人 KIMURA, Shigeto [JP]/[JP] (UsOnly)
Inventors
  • 山内 康嗣 YAMAUCHI, Koji
  • 吉田 重信 YOSHIDA, Shigenobu
  • 蜂須賀 亨 HACHISUKA, Tooru
  • 木村 繁人 KIMURA, Shigeto
Agents
  • 大谷 保 OHTANI, Tamotsu
Priority Data
2010-24751304.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) GAS-BARRIER LAMINATE FILM
(FR) FILM STRATIFIÉ DE BARRIÈRE AUX GAZ
(JA) ガスバリア性積層フィルム
Abstract
(EN)
Provided are: a gas-barrier laminate film which can be produced with good productivity, has high transparency and high gas barrier properties, has excellent interlayer adhesion strength among constituent layers thereof, and cannot be curled; and a process for producing the film. The gas-barrier laminate film comprises an inorganic thin film layer formed by a vacuum deposition technique, an inorganic thin film layer formed by a chemical deposition technique and an inorganic thin film layer formed by a vacuum deposition technique which are formed in this order on at least one surface of a base film, wherein each of the inorganic thin film layers formed by the vacuum deposition technique has a thickness of 0.1 to 500 nm inclusive and the inorganic thin film layer formed by the chemical deposition technique has a carbon content of not less than 0.5 at% and less than 20 at.% and a thickness of smaller than 20 nm.
(FR)
L'invention concerne : un film stratifié de barrière aux gaz qui peut être obtenu à bonne productivité, a une transparence élevée et a des propriétés élevées de barrière aux gaz, a une excellente force d'adhésion entre les couches parmi les couches constitutives de celui-ci, et ne peut pas s'enrouler ; et un procédé de fabrication du film. Le film stratifié de barrière aux gaz comprend une couche de film mince inorganique formée par une technique de dépôt sous vide, une couche de film mince inorganique formée par une technique de dépôt chimique et une couche de film mince inorganique formée par une technique de dépôt sous vide qui sont formées dans cet ordre sur au moins une surface d'un film de base, chacune des couches de film mince inorganique formées par la technique de dépôt sous vide ayant une épaisseur de 0,1 à 500 nm inclus et la couche de film mince inorganique formée par la technique de dépôt chimique ayant une teneur en carbone non inférieure à 0,5 % atomiques et inférieure à 20 % atomiques et une épaisseur inférieure à 20 nm.
(JA)
 生産性が良好であり、透明性が高く、高いガスバリア性を示し、かつ構成層間の優れた密着強度を有し、カールの発生のないガスバリア積層フィルム、及び該フィルムを製造する方法を提供する。 基材フィルムの少なくとも一方の面に、真空蒸着法により形成した無機薄膜層、化学蒸着法により形成した無機薄膜層及び真空蒸着法により形成した無機薄膜層をこの順で有し、かつ前記真空蒸着法により形成した無機薄膜層の膜厚が0.1nm以上、500nm以下であり、前記化学蒸着法により形成した無機薄膜層の炭素含有量が0.5at.%以上、20at.%未満であり、膜厚が20nm未満であるガスバリア性積層フィルム。
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