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1. WO2012060284 - LOW-TEMPERATURE SINTERING CONDUCTIVE PASTE, CONDUCTIVE FILM USING SAME, AND METHOD FOR FORMING CONDUCTIVE FILM

Publication Number WO/2012/060284
Publication Date 10.05.2012
International Application No. PCT/JP2011/074890
International Filing Date 28.10.2011
IPC
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H01B 1/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01B 13/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13Apparatus or processes specially adapted for manufacturing conductors or cables
H05K 1/09 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
H05K 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using printing techniques to apply the conductive material
CPC
H01B 1/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
14Conductive material dispersed in non-conductive inorganic material
16the conductive material comprising metals or alloys
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
Applicants
  • DOWAエレクトロニクス株式会社 DOWA ELECTRONICS MATERIALS CO., LTD. [JP]/[JP] (AllExceptUS)
  • 樋之津 崇 HINOTSU, Takashi [JP]/[JP] (UsOnly)
  • 檜山 優斗 HIYAMA, Yuto [JP]/[JP] (UsOnly)
  • 上山 俊彦 UEYAMA, Toshihiko [JP]/[JP] (UsOnly)
Inventors
  • 樋之津 崇 HINOTSU, Takashi
  • 檜山 優斗 HIYAMA, Yuto
  • 上山 俊彦 UEYAMA, Toshihiko
Agents
  • 廣幸 正樹 HIROKOH, Masaki
Priority Data
PCT/JP2010/06945301.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LOW-TEMPERATURE SINTERING CONDUCTIVE PASTE, CONDUCTIVE FILM USING SAME, AND METHOD FOR FORMING CONDUCTIVE FILM
(FR) PÂTE CONDUCTRICE POUR FRITTAGE À BASSE TEMPÉRATURE, FILM CONDUCTEUR METTANT EN ŒUVRE LADITE PÂTE ET PROCÉDÉ DE FORMATION DE FILM CONDUCTEUR
(JA) 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
Abstract
(EN)
When using a substrate having a low resistance to heat, it is preferred that heat treatment is performed at approximately 120°C which is a temperature in which the substrate does not become deformed. Moreover, if it is possible to achieve a low resistance regardless of the type of the resin used for the conductive paste, it will be possible to design a paste for different purposes, and the fields to which the paste could be applied will increase. Thus, provided is a conductive paste capable of forming a conductive film exhibiting a high conductivity even at a low temperature of approximately 120°C regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin. A method for forming a conductive film, wherein a conductive paste in which a C2-8 dicarboxylic acid is added to a paste comprising a resin, a dispersion medium, and silver nanoparticles covered with a C2-6 organic substance is used as the metallization paste.
(FR)
Lors de l'utilisation d'un substrat qui présente une faible résistance à la chaleur, il est préférable d'effectuer le traitement thermique à une température d'environ 120°C qui n'entraîne pas la déformation du substrat. De plus, l'obtention d'une faible résistance indépendamment du type de résine utilisé pour la pâte conductrice permet de concevoir une pâte d'usages multiples et d'étendre le champ d'application de la pâte. Ainsi, cette invention concerne une pâte conductrice qui permet de former un film conducteur présentant une conductivité élevée même à une basse température d'environ 120°C, indépendamment du fait que la résine qui la constitue soit une résine thermodurcissable ou une résine thermoplastique. L'invention concerne en outre un procédé de formation d'un film conducteur, consistant à utiliser en tant que pâte de métallisation une pâte conductrice formée par ajout d'un acide dicarboxylique en C2-8 à une pâte comprenant une résine, un milieu de dispersion et des nanoparticules de cuivre recouvertes d'une substance organique en C2-6.
(JA)
 耐熱性の低い基板を利用しようとすると、変形などが生じない120℃近傍での熱処理が望まれる。また、導電性ペーストに用いる樹脂の種類によらず低抵抗化を図ることができれば、目的に応じたペーストの設計も可能になり、また適用分野も広くなる。そこで、構成される樹脂が、熱硬化性であるか、熱可塑型であるかの種類によらず、120℃程度の低温であっても高い導電性を発現する導電膜を形成することのできる導電性ペーストを提供すること。 導電性膜の形成方法であって、炭素数2~6の有機物で被覆された銀ナノ粒子、分散媒および樹脂から構成されるペーストに炭素数2~8のジカルボン酸が添加された、導電性ペーストを配線形成ペーストとして用いる。
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