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1. WO2012060049 - LIGHT EMITTING DEVICE, BULB-TYPE LAMP, AND ILLUMINATING DEVICE

Publication Number WO/2012/060049
Publication Date 10.05.2012
International Application No. PCT/JP2011/005279
International Filing Date 20.09.2011
IPC
F21S 2/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
2Systems of lighting devices, not provided for in main groups F21S4/-F21S10/113
F21S 8/04 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
8Lighting devices intended for fixed installation
04intended only for mounting on a ceiling or like overhead structure
F21Y 101/02 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V124
101Point-like light sources
02Miniature, e.g. light emitting diodes (LED)
CPC
F21K 9/232
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
20Light sources comprising attachment means
23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
232specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
F21V 3/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
3Globes; Bowls; Cover glasses
F21Y 2115/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
2115Light-generating elements of semiconductor light sources
10Light-emitting diodes [LED]
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
Applicants
  • パナソニック株式会社 PANASONIC CORPORATION [JP]/[JP] (AllExceptUS)
  • 竹内 延吉 TAKEUCHI, Nobuyoshi (UsOnly)
  • 松田 次弘 MATSUDA, Tsugihiro (UsOnly)
  • 永井 秀男 NAGAI, Hideo (UsOnly)
  • 三貴 政弘 MIKI, Masahiro (UsOnly)
  • 植本 隆在 UEMOTO, Takaari (UsOnly)
Inventors
  • 竹内 延吉 TAKEUCHI, Nobuyoshi
  • 松田 次弘 MATSUDA, Tsugihiro
  • 永井 秀男 NAGAI, Hideo
  • 三貴 政弘 MIKI, Masahiro
  • 植本 隆在 UEMOTO, Takaari
Agents
  • 新居 広守 NII, Hiromori
Priority Data
2010-24795304.11.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIGHT EMITTING DEVICE, BULB-TYPE LAMP, AND ILLUMINATING DEVICE
(FR) DISPOSITIF ÉMETTEUR DE LUMIÈRE, LAMPE DU TYPE AMPOULE ET DISPOSITIF D'ÉCLAIRAGE
(JA) 発光装置、電球形ランプ及び照明装置
Abstract
(EN)
Provided is a light emitting device wherein heat generated in an LED can be efficiently dissipated. A light emitting device of the present invention is provided with a base (140), and LED chips (150) mounted on the base (140). The base (140) is a translucent base composed of ceramic particles. When a base (140) region including an element mounted region (A2) having the LED chips (150) mounted therein is set as a main region, the average particle diameter of each of the ceramic particles in the main region is 10-40 μm. Furthermore, when a base (140) region at the periphery of the base end portion is set as an end portion region (A1), the average particle diameter of each of the ceramic particles in the end portion region (A1) is preferably smaller than the average particle diameter of each of the ceramic particles in the element mounted region (A2).
(FR)
L'invention porte sur un dispositif émetteur de lumière, dans lequel dispositif de la chaleur générée dans une diode électroluminescente peut être dissipée efficacement. Un dispositif émetteur de lumière selon la présente invention comporte une base (140) et des puces de diodes électroluminescentes (150) montées sur la base (140). La base (140) est une base translucide constituée par des particules céramiques. Lorsqu'une région de base (140) comprenant une région de montage d'éléments (A2) à l'intérieur de laquelle sont montées les puces de diodes électroluminescentes (150) est établie comme région principale, le diamètre de particules moyen de chacune des particules céramiques dans la région principale est de 10 à 40 µm. De plus, lorsqu'une région de base (140) à la périphérie de la partie d'extrémité de base est établie comme région de partie d'extrémité (A1), le diamètre de particules moyen de chacune des particules céramiques dans la région de partie d'extrémité (A1) est, de préférence, inférieur au diamètre de particules moyen de chacune des particules céramiques dans la région de montage d'éléments (A2).
(JA)
 LEDで発生する熱を効率よく放熱することができる発光装置を提供する。 本発明に係る発光装置は、基台(140)と、基台(140)に実装されたLEDチップ(150)とを備える。基台(140)は、セラミックス粒子からなる透光性の基台である。基台(140)のLEDチップ(150)が実装される素子実装領域(A2)を含む領域を主領域とすると、主領域におけるセラミックス粒子の平均粒径は、10μm以上、40μm以下である。また、基台(140)の端部周辺の領域を端部領域(A1)とすると、端部領域(A1)におけるセラミックス粒子の平均粒径は、素子実装領域(A2)におけるセラミックス粒子の平均粒径よりも小さいことが好ましい。
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