Processing

Please wait...

Settings

Settings

Goto Application

1. WO2012059974 - LOW-TEMPERATURE SINTERING CONDUCTIVE PASTE, CONDUCTIVE FILM USING SAME, AND METHOD FOR FORMING CONDUCTIVE FILM

Publication Number WO/2012/059974
Publication Date 10.05.2012
International Application No. PCT/JP2010/069453
International Filing Date 01.11.2010
IPC
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
C08K 3/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
C08K 9/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9Use of pretreated ingredients
04Ingredients treated with organic substances
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
CPC
H01B 1/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
14Conductive material dispersed in non-conductive inorganic material
16the conductive material comprising metals or alloys
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
Applicants
  • DOWAエレクトロニクス株式会社 DOWA ELECTRONICS MATERIALS CO., LTD. [JP]/[JP] (AllExceptUS)
  • 樋之津 崇 HINOTSU, Takashi [JP]/[JP] (UsOnly)
  • 檜山 優斗 HIYAMA,Yuto [JP]/[JP] (UsOnly)
  • 上山 俊彦 UEYAMA, Toshihiko [JP]/[JP] (UsOnly)
Inventors
  • 樋之津 崇 HINOTSU, Takashi
  • 檜山 優斗 HIYAMA,Yuto
  • 上山 俊彦 UEYAMA, Toshihiko
Agents
  • 廣幸 正樹 HIROKOH, Masaki
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LOW-TEMPERATURE SINTERING CONDUCTIVE PASTE, CONDUCTIVE FILM USING SAME, AND METHOD FOR FORMING CONDUCTIVE FILM
(FR) PÂTE CONDUCTRICE POUR FRITTAGE À BASSE TEMPÉRATURE, FILM CONDUCTEUR METTANT EN ŒUVRE LADITE PÂTE, ET PROCÉDÉ DE FORMATION DE FILM CONDUCTEUR
(JA) 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
Abstract
(EN)
Provided is a conductive paste capable of forming a conductive film exhibiting a high conductivity even at a low temperature of approximately 120°C regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin. A method for forming a conductive film, wherein a conductive paste in which a C2-8 dicarboxylic acid is added to a paste comprising a resin, a dispersion medium, and silver nanoparticles covered with a C2-8 carboxylic acid or an organic substance comprising a derivative thereof is used as the metallization paste.
(FR)
Cette invention concerne une pâte conductrice apte à former un film conducteur présentant une bonne conductivité même à des températures basses d'environ 120°C, et ce indépendamment du fait que la résine de base soit une résine thermodurcissable ou une résine thermoplastique. L'invention concerne en outre un procédé de formation d'un film conducteur, comprenant l'étape consistant à utiliser, en tant que pâte de métallisation, une pâte conductrice dans laquelle un acide dicarboxylique en C2-8 est ajouté à une pâte comprenant une résine, un milieu de dispersion, et des nanoparticules d'argent recouvertes d'un acide carboxylique en C2-8 ou une substance organique comprenant un dérivé de celui-ci.
(JA)
 その構成される樹脂が、熱硬化性であるか、熱可塑性であるかの種類によらず、120℃程度の低温であっても高い導電性を発現する導電膜を形成することのできる導電性ペーストを提供すること。 導電性膜の形成方法であって、炭素数2~8のカルボン酸もしくはその誘導体からなる有機物で被覆された銀ナノ粒子、分散媒および樹脂から構成されるペーストに炭素数2~8のジカルボン酸が添加された、導電性ペーストを配線形成ペーストとして用いる。
Also published as
Latest bibliographic data on file with the International Bureau