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1. WO2012058023 - SILICONE RESIN COMPOSITION HAVING HIGH REFRACTIVE INDEX

Publication Number WO/2012/058023
Publication Date 03.05.2012
International Application No. PCT/US2011/056312
International Filing Date 14.10.2011
IPC
C08L 83/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
CPC
C08G 77/12
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
77Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
04Polysiloxanes
12containing silicon bound to hydrogen
C08G 77/58
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
77Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
48in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
58Metal-containing linkages
C08K 5/5425
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
54Silicon-containing compounds
541containing oxygen
5425containing at least one C=C bond
C08L 83/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
C09D 183/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
183Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US] (AllExceptUS)
  • TIEN, Pei (UsOnly)
  • LEE, Hsu-Hsiu (UsOnly)
  • CHANG, Pei Chun (UsOnly)
Inventors
  • TIEN, Pei
  • LEE, Hsu-Hsiu
  • CHANG, Pei Chun
Agents
  • FLORCZAK, Yen Tong,
Priority Data
201010525520.627.10.2010CN
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SILICONE RESIN COMPOSITION HAVING HIGH REFRACTIVE INDEX
(FR) COMPOSITION À BASE DE RÉSINE DE SILICONE PRÉSENTANT UN INDICE DE RÉFRACTION ÉLEVÉ
Abstract
(EN)
The present disclosure relates to a silicone resin composition comprising a silicone resin having at least one terminal hydrogen group, a metal alkoxide having at least one C1-6 alkoxy group, and a silane having at least one terminal vinyl group and at least one terminal C1-6 alkoxy or hydroxyl group. The composition cured has a refractive index greater than 1.4. The present disclosure also relates to an optoelectronic device, which is encapsulated with the aforementioned composition.
(FR)
La présente invention concerne une composition à base de résine de silicone comprenant une résine de silicone comportant au moins un groupe hydrogéné terminal, un alcoxyde métallique comportant au moins un groupe alkoxy en C1-C6, et un silane comportant au moins un groupe vinyle terminal et au moins un groupe alkoxy ou hydroxyle terminal en C1-C6. Une fois durcie, cette composition présente un indice de réfraction supérieur à 1,4. La présente invention concerne également un dispositif optoélectronique, qui est encapsulé dans la composition susmentionnée.
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