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1. WO2012057276 - LIGHT-EMITTING MODULE, AND LIGHTING EQUIPMENT

Publication Number WO/2012/057276
Publication Date 03.05.2012
International Application No. PCT/JP2011/074838
International Filing Date 27.10.2011
IPC
H01L 33/60 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
58Optical field-shaping elements
60Reflective elements
F21V 19/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19Fastening of light sources or lamp holders
F21Y 101/02 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V124
101Point-like light sources
02Miniature, e.g. light emitting diodes (LED)
CPC
F21K 9/23
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
20Light sources comprising attachment means
23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
F21K 9/232
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
20Light sources comprising attachment means
23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
232specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
F21V 3/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
3Globes; Bowls; Cover glasses
F21Y 2115/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
2115Light-generating elements of semiconductor light sources
10Light-emitting diodes [LED]
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
Applicants
  • 東芝ライテック株式会社 TOSHIBA LIGHTING & TECHNOLOGY CORPORATION [JP]/[JP] (AllExceptUS)
  • 三瓶 友広 SANPEI, Tomohiro [JP]/[JP] (UsOnly)
  • 竹中 絵梨果 TAKENAKA, Erika [JP]/[JP] (UsOnly)
Inventors
  • 三瓶 友広 SANPEI, Tomohiro
  • 竹中 絵梨果 TAKENAKA, Erika
Agents
  • 蔵田 昌俊 KURATA, Masatoshi
Priority Data
2010-24419929.10.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LIGHT-EMITTING MODULE, AND LIGHTING EQUIPMENT
(FR) MODULE ÉLECTROLUMINESCENT ET ÉQUIPEMENT D'ÉCLAIRAGE
(JA) 発光モジュール、および照明器具
Abstract
(EN)
A light-emitting module according to an embodiment is formed by layering a metal reflective layer on a substrate containing a polyimide layer, and mounting a light-emitting element to the reflective layer through a eutectic solder.
(FR)
Un module électroluminescent selon un mode de réalisation de l'invention est formé par dépôt d'une couche réfléchissante de métal sur un substrat contenant une couche de polyimide, et par montage d'un élément électroluminescent sur la couche réfléchissante au moyen d'un métal d'apport eutectique.
(JA)
 実施形態に係る発光モジュールは、ポリイミド層を含む基板に金属製の反射層を積層し、この反射層に共晶はんだを介して発光素子を実装して形成される。
Also published as
Latest bibliographic data on file with the International Bureau