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1. WO2012057076 - METHOD FOR MANUFACTURING SOLAR CELL WITH WIRING SHEET, METHOD FOR MANUFACTURING SOLAR CELL MODULE, SOLAR CELL WITH WIRING SHEET, AND SOLAR CELL MODULE

Publication Number WO/2012/057076
Publication Date 03.05.2012
International Application No. PCT/JP2011/074428
International Filing Date 24.10.2011
IPC
H01L 31/042 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic conversion devices
042PV modules or arrays of single PV cells
H01L 31/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic conversion devices
CPC
H01L 24/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
H01L 24/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
H01L 31/02021
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
02016Circuit arrangements of general character for the devices
02019for devices characterised by at least one potential jump barrier or surface barrier
02021for solar cells
H01L 31/022441
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0224Electrodes
022408for devices characterised by at least one potential jump barrier or surface barrier
022425for solar cells
022441Electrode arrangements specially adapted for back-contact solar cells
H01L 31/048
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic [PV] conversion devices
042PV modules or arrays of single PV cells
048Encapsulation of modules
H01L 31/0516
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic [PV] conversion devices
042PV modules or arrays of single PV cells
05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
0504specially adapted for series or parallel connection of solar cells in a module
0516specially adapted for interconnection of back-contact solar cells
Applicants
  • シャープ株式会社 SHARP KABUSHIKI KAISHA [JP]/[JP] (AllExceptUS)
  • 山田 隆行 YAMADA, Takayuki (UsOnly)
  • 今瀧 智雄 IMATAKI, Tomoo (UsOnly)
  • 白木 朋代 SHIRAKI, Tomoyo (UsOnly)
  • 常深 安紀子 TSUNEMI, Akiko (UsOnly)
  • 内藤 真介 NAITO, Shinsuke (UsOnly)
Inventors
  • 山田 隆行 YAMADA, Takayuki
  • 今瀧 智雄 IMATAKI, Tomoo
  • 白木 朋代 SHIRAKI, Tomoyo
  • 常深 安紀子 TSUNEMI, Akiko
  • 内藤 真介 NAITO, Shinsuke
Agents
  • 特許業務法人深見特許事務所 Fukami Patent Office, p.c.
Priority Data
2010-24439729.10.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR MANUFACTURING SOLAR CELL WITH WIRING SHEET, METHOD FOR MANUFACTURING SOLAR CELL MODULE, SOLAR CELL WITH WIRING SHEET, AND SOLAR CELL MODULE
(FR) PROCÉDÉ DE FABRICATION DE CELLULE PHOTOVOLTAÏQUE À FEUILLET DE CÂBLAGE, PROCÉDÉ DE FABRICATION DE MODULE DE CELLULES PHOTOVOLTAÏQUES, CELLULE PHOTOVOLTAÏQUE À FEUILLET DE CÂBLAGE, ET MODULE DE CELLULES PHOTOVOLTAÏQUES
(JA) 配線シート付き太陽電池セルの製造方法、太陽電池モジュールの製造方法、配線シート付き太陽電池セルおよび太陽電池モジュール
Abstract
(EN)
Provided is method for manufacturing a solar cell with a wiring sheet in which a fixing resin (22a) is disposed between either or both of electrodes (6, 7) for a solar cell (8) and wiring (12, 13) of a wiring sheet (10), after which the fixing resin is put into a first cured state. Thereafter, joining members (21) containing a conductive substance are disposed, and the solar cell (8) and wiring sheet (10) are mated. A fixing resin (22b) is made soft in the first cured state and is cured again to form a second cured state. Also provided is a method for manufacturing a solar cell module. Also provided are a solar cell with a wiring sheet and a solar cell module.
(FR)
La présente invention concerne un procédé de fabrication d'une cellule photovoltaïque comportant un feuillet de câblage. Ce procédé consiste à disposer une résine de fixation (22a) entre l'une au moins des électrodes (6, 7) destinées à la cellule photovoltaïque (8) et le câblage (12, 13) du feuillet de câblage (10), puis à amener la résine de fixation dans un premier état de prise. Le procédé consiste ensuite à disposer des éléments de jonction (21) contenant une substance conductrice, et à mettre en coïncidence la cellule photovoltaïque (8) et le feuillet de câblage (10). Dans le premier état de prise, cette résine de fixation (22b), qui reste encore molle dans le premier état de prise, subit un nouveau durcissement lui faisant atteindre le second état de prise. L'invention concerne également, d'une part un procédé de fabrication d'un module de cellules photovoltaïques, d'autre part une cellule photovoltaïque comportant un feuillet de câblage, et enfin un module de cellules photovoltaïques.
(JA)
 太陽電池セル(8)の電極(6,7)間および配線シート(10)の配線(12,13)間の少なくとも一方に固定樹脂(22a)を設置した後に、固定樹脂を第1の硬化状態とし、その後、導電性物質を含む接合部材(21)を設置し、太陽電池セル(8)と配線シート(10)とを重ね合わせて、第1の硬化状態の固定樹脂(22b)を軟化し、再度硬化して第2の硬化状態とする配線シート付き太陽電池セルの製造方法、太陽電池モジュールの製造方法、配線シート付き太陽電池セルおよび太陽電池モジュールである。
Also published as
Latest bibliographic data on file with the International Bureau