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1. WO2012057025 - LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

Publication Number WO/2012/057025
Publication Date 03.05.2012
International Application No. PCT/JP2011/074301
International Filing Date 21.10.2011
IPC
B23K 26/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
10using a fixed support
B23K 37/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
37Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the other main groups of this subclass
04for holding or positioning work
B23K 37/047 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
37Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the other main groups of this subclass
04for holding or positioning work
047moving work to adjust its position between soldering, welding or cutting steps
B23K 37/053 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
37Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the other main groups of this subclass
04for holding or positioning work
053aligning cylindrical work; Clamping devices therefor
B23K 7/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
7Cutting, scarfing, or desurfacing by applying flames
10Auxiliary devices, e.g. for guiding or supporting the torch
CPC
B23K 2101/10
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
04Tubular or hollow articles
10Pipe-lines
B23K 2101/28
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
28Beams
B23K 2103/04
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
02Iron or ferrous alloys
04Steel or steel alloys
B23K 26/02
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
B23K 26/0823
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
0823Devices involving rotation of the workpiece
B23K 26/0876
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
0869Devices involving movement of the laser head in at least one axial direction
0876in at least two axial directions
Applicants
  • 株式会社 アマダ AMADA COMPANY, LIMITED [JP]/[JP] (AllExceptUS)
  • 西山 治巳 NISHIYAMA, Harumi [JP]/[JP] (UsOnly)
  • 小野寺 宏 ONODERA, Hiroshi [JP]/[JP] (UsOnly)
  • 足立 正樹 ADACHI, Masaki [JP]/[JP] (UsOnly)
  • 阿部 敏紀 ABE, Toshinori [JP]/[JP] (UsOnly)
Inventors
  • 西山 治巳 NISHIYAMA, Harumi
  • 小野寺 宏 ONODERA, Hiroshi
  • 足立 正樹 ADACHI, Masaki
  • 阿部 敏紀 ABE, Toshinori
Agents
  • 三好 秀和 MIYOSHI, Hidekazu
Priority Data
2010-23842425.10.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
(FR) DISPOSITIF DE TRAITEMENT AU LASER ET PROCÉDÉ DE TRAITEMENT AU LASER
(JA) レーザ加工装置、及び、レーザ加工方法
Abstract
(EN)
Provided is a laser processing device comprising: a processing head; a plate-shaped workpiece processing table for processing plate-shaped workpieces; a rod-shaped workpiece processing table for processing rod-shaped workpieces, comprising a rod-shaped workpiece gripping section; and a processing region with the processing head disposed moveably therein. The plate-shaped workpiece processing table is disposed so as to be movable from one side of the processing region to the processing region. The rod-shaped workpiece processing table is disposed so as to be movable from another side of the processing region, which is opposite to the one side of the processing region, to the processing region. The laser processing device can not only make the plate-shaped workpiece processing table and the rod-shaped workpiece processing table move to and retreat from the processing area, the device can also easily perform switching work.
(FR)
L'invention porte sur un dispositif de traitement au laser qui comprend : une tête de traitement ; une table de traitement de pièces en forme de plaque destinée à traiter des pièces en forme de plaque ; une table de traitement de pièces en forme de tige destinée à traiter des pièces en forme de tige, qui comprend une section de serrage de pièces en forme de tige, et une région de traitement comportant une tête de traitement disposée mobile dans cette région. La table de traitement de pièces en forme de plaque est disposée de manière à pouvoir se déplacer d'un côté de la région de traitement à la région de traitement. La table de traitement de pièces en forme de tige est disposée de manière à pouvoir se déplacer d'un autre côté de la région de traitement, qui est à l'opposé du premier côté de la région de traitement, à la région de traitement. Le dispositif de traitement au laser ne peut pas seulement amener la table de traitement de pièces en forme de plaque et la table de traitement de pièces en forme de tige à la zone de traitement et les en éloigner, le dispositif peut aussi facilement exécuter le travail de changement.
(JA)
 レーザ加工装置は、加工ヘッドと、板状ワークを加工するための板状ワーク加工テーブルと、棒状ワーク把持部を備えた、棒状ワークを加工するための棒状ワーク加工テーブルと、加工ヘッドが移動可能に設けられた加工領域と、を備えている。板状ワーク加工テーブルは、加工領域の一側から加工領域へと移動可能に設けられている。棒状ワーク加工テーブルは、一側の反対側である加工領域の他側から加工領域へと移動可能に設けられている。上記レーザ加工装置によれば、板状ワークの加工と棒状ワークの加工の切替時には、板状ワーク加工テーブルと棒状ワーク加工テーブルとを、加工領域に移動/から退避させるだけでよく、切替作業を容易に行うことができる。
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