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1. WO2012056883 - COMPOSITE SUBSTRATE, MODULE, AND METHOD OF PRODUCING COMPOSITE SUBSTRATE

Publication Number WO/2012/056883
Publication Date 03.05.2012
International Application No. PCT/JP2011/073399
International Filing Date 12.10.2011
IPC
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H05K 1/0306
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0306Inorganic insulating substrates, e.g. ceramic, glass
H05K 1/11
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 2201/0367
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0364Conductor shape
0367Metallic bump or raised conductor not used as solder bump
H05K 2201/0376
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0364Conductor shape
0376Flush conductors, i.e. flush with the surface of the printed circuit
H05K 2201/09527
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09509Blind vias, i.e. vias having one side closed
09527Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
H05K 2201/098
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
098Special shape of the cross-section of conductors, e.g. very thick plated conductors
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP] (AllExceptUS)
  • 伊勢坊 和弘 ISEBO Kazuhiro [JP]/[JP] (UsOnly)
Inventors
  • 伊勢坊 和弘 ISEBO Kazuhiro
Agents
  • 福永 正也 FUKUNAGA Masaya
Priority Data
2010-23944526.10.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COMPOSITE SUBSTRATE, MODULE, AND METHOD OF PRODUCING COMPOSITE SUBSTRATE
(FR) SUBSTRAT COMPOSITE, MODULE, ET PROCÉDÉ DE PRODUCTION DE SUBSTRAT COMPOSITE
(JA) 複合基板、モジュール、複合基板の製造方法
Abstract
(EN)
Provided are a composite substrate, a module comprising the composite substrate, and a method of producing the composite substrate, that are capable of dispersing the stress applied to external connecting terminals by dropping, and that can sufficiently ensure the connection strength of a ceramic substrate and the external connecting terminals. The composite substrate according to the present invention comprises: the ceramic substrate (1), at least one side of which has circuit wiring for mounting an electronic component (2) formed thereon; the plurality of external connecting terminals (3) that are formed on one side of the ceramic substrate (1); and a resin layer (5) that is formed on the one side of the ceramic substrate (1). The external connecting terminals (3) are of a shape such that the cross-sectional area becomes smaller the further away from the one surface of the ceramic substrate (1), and a portion or all of the terminal surface that is on the opposite side of the terminal surface connected with the ceramic substrate (1) is exposed through the resin layer (5).
(FR)
L'invention concerne un substrat composite, un module comprenant le substrat composite, et un procédé de production du substrat composite, qui permettent de disperser la contrainte appliquée aux bornes de connexion externes par une chute, de façon à pouvoir garantir une robustesse suffisante pour la connexion d'un substrat en céramique et des bornes de connexion externes. Le substrat composite de la présente invention comprend : le substrat en céramique (1), sur au moins un côté duquel se trouve un câblage de circuit pour le montage d'un composant électronique (2) ; la pluralité de bornes de connexion externes (3) qui se trouvent sur un côté du substrat en céramique (1) ; et une couche de résine (5) qui se trouve sur un côté du substrat en céramique (1). La forme des bornes de connexion externes (3) est telle que la section transversale s'amenuise à mesure que l'on s'éloigne de la surface du substrat en céramique (1), et une partie ou la totalité de la surface des bornes qui se trouve du côté opposé de la surface des bornes connectée au substrat en céramique (1) est exposée à travers la couche de résine (5).
(JA)
 本発明は、落下等により外部接続端子に加わる応力を分散させることができ、セラミック基板と外部接続端子との接続強度を十分に確保することができる複合基板、該複合基板を備えるモジュール、及び複合基板の製造方法を提供する。 本発明に係る複合基板は、少なくとも片面に電子部品(2)を実装するための回路配線が形成されているセラミック基板(1)と、セラミック基板(1)の一面に形成されている複数の外部接続端子(3)と、セラミック基板(1)の一面に形成されている樹脂層(5)とを備える。外部接続端子(3)は、セラミック基板(1)の一面から離隔するにしたがって断面積が小さくなる形状であり、セラミック基板(1)と接続される端面とは反対側の端面の一部又は全部が樹脂層(5)から露出されている。
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