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1. WO2012056661 - ELECTRONIC COMPONENTS ASSEMBLY

Publication Number WO/2012/056661
Publication Date 03.05.2012
International Application No. PCT/JP2011/005895
International Filing Date 20.10.2011
IPC
H01L 25/065 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/78
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 25/07 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/78
H01L 25/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
CPC
H01L 21/563
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
563Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
H01L 2223/6605
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6605High-frequency electrical connections
H01L 2224/02311
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
023Redistribution layers [RDL] for bonding areas
0231Manufacturing methods of the redistribution layers
02311Additive methods
H01L 2224/0235
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
023Redistribution layers [RDL] for bonding areas
0235Shape of the redistribution layers
H01L 2224/0237
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
023Redistribution layers [RDL] for bonding areas
0237Disposition of the redistribution layers
H01L 2224/02375
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
023Redistribution layers [RDL] for bonding areas
0237Disposition of the redistribution layers
02375Top view
Applicants
  • パナソニック株式会社 PANASONIC CORPORATION [JP]/[JP] (AllExceptUS)
  • 高下 博光 TAKASHITA, Hiromitsu [JP]/[JP] (UsOnly)
  • 武田 剛 TAKEDA, Tsuyoshi [JP]/[JP] (UsOnly)
  • 今野 優子 KONNO, Yuko [JP]/[JP] (UsOnly)
  • 藤原 弘明 FUJIWARA, Hiroaki [JP]/[JP] (UsOnly)
  • 吉岡 愼悟 YOSHIOKA, Shingo [JP]/[JP] (UsOnly)
Inventors
  • 高下 博光 TAKASHITA, Hiromitsu
  • 武田 剛 TAKEDA, Tsuyoshi
  • 今野 優子 KONNO, Yuko
  • 藤原 弘明 FUJIWARA, Hiroaki
  • 吉岡 愼悟 YOSHIOKA, Shingo
Agents
  • 小谷 悦司 KOTANI, Etsuji
Priority Data
2010-23894225.10.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC COMPONENTS ASSEMBLY
(FR) ENSEMBLE DE COMPOSANTS ÉLECTRONIQUES
(JA) 電子部品の接合形態
Abstract
(EN)
[Problem] To reduce the mismatching of impedance at a connected part when electronic components are electrically connected to each other. [Solution] An electronic components assembly, wherein electronic components (1, 2) are electrically connected to each other, and wherein a wiring line (11) formed the surface (1a) of the first electronic component (1) and a wiring line (12) formed on the surface (2a) of the second electronic component (2) face each other and are bonded to each other through an electrically conductive material (13), thereby electrically connecting the first electronic component (1) to the second electronic component (2). The electrically conductive material (13) is a resin composition containing a solder or an electrically conductive filler.
(FR)
L'invention vise à réduire le défaut d'adaptation d'impédance au niveau d'une pièce connectée lorsque des composants électroniques sont connectés électriquement entre eux. À cet effet, est proposé un ensemble de composants électroniques dans lequel les composants électroniques (1, 2) sont connectés électriquement entre eux et une piste conductrice (11) formée à la surface (1a) du premier composant électronique (1) et une piste conductrice (12) formée sur la surface (2a) du second composant électronique (2) se font face et sont collées l'une à l'autre par un matériau électroconducteur (13), ce qui connecte électriquement le premier composant électronique (1) et le second composant électronique (2). Le matériau électroconducteur (13) est une composition de résine contenant une soudure ou une charge électroconductrice.
(JA)
【課題】電子部品同士を電気的に接続する場合に、接続部でのインピーダンスの不整合を低減する。 【解決手段】電子部品1,2同士を電気的に接続する電子部品の接合形態において、第1の電子部品1の表面1aに形成された配線11と第2の電子部品2の表面2aに形成された配線12とが向き合され、導電体13を間に挟んで接合されることにより、第1の電子部品1と第2の電子部品2とが電気的に接続されている。導電体13は半田又は導電性フィラーを含有する樹脂組成物である。
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