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1. WO2012055725 - SYSTEM FOR LASER DIRECT WRITING OF MESA STRUCTURES HAVING NEGATIVELY SLOPED SIDEWALLS

Publication Number WO/2012/055725
Publication Date 03.05.2012
International Application No. PCT/EP2011/068168
International Filing Date 18.10.2011
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
CPC
B23K 26/02
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
B41J 2/442
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
435characterised by selective application of radiation to a printing material or impression-transfer material
44using single radiation source ; per colour; , e.g. lighting beams or shutter arrangements
442using lasers
B41J 2/465
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
435characterised by selective application of radiation to a printing material or impression-transfer material
465using masks, e.g. light-switching masks
G03F 7/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 7/2053
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
2053using a laser
G03F 7/70383
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70375Imaging systems not otherwise provided for, e.g. multiphoton lithography; Imaging systems comprising means for converting one type of radiation into another type of radiation, systems comprising mask with photo-cathode
70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
Applicants
  • COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES [FR]/[FR] (AllExceptUS)
  • DELLEA, Olivier [FR]/[FR] (UsOnly)
  • FUGIER, Pascal [FR]/[FR] (UsOnly)
  • TEBBY, Zoé [FR]/[FR] (UsOnly)
Inventors
  • DELLEA, Olivier
  • FUGIER, Pascal
  • TEBBY, Zoé
Agents
  • BREDA, Jean-Marc
Priority Data
105883227.10.2010FR
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) SYSTEM FOR LASER DIRECT WRITING OF MESA STRUCTURES HAVING NEGATIVELY SLOPED SIDEWALLS
(FR) BANC D'ECRITURE LASER DIRECTE DE STRUCTURES MESA COMPORTANT DES FLANCS A PENTES NEGATIVES
Abstract
(EN)
The general field of the invention is that of photolithography systems intended for producing electronic components, using the lift-off technique, on a flat substrate (1) comprising one or more flat photosensitive layers. The system according to the invention is a laser direct-write system. It comprises optical or mechanical means arranged so that the useful part of the optical beam (F) is inclined in the plane of the photosensitive layers in order to create re-entrant profiles in said layers, the useful part of the optical beam being the part of the optical beam that actually contributes to create said profiles. In a preferred embodiment of the invention, the system comprises means (50) for partially blocking the optical beam, said means being located in the vicinity of the focusing optics (23).
(FR)
Le domaine général de l'invention est celui des bancs de photolithographie destiné à réaliser des composants électroniques par la technique connue sous le terme de « lift-off » sur un substrat plan (1) comportant une ou plusieurs couches planes photosensibles. Le banc selon l'invention est à écriture laser directe. Il comprend des moyens optiques ou mécaniques agencés de façon que la partie utile du faisceau optique (F) soit inclinée au niveau du plan des couches photosensibles afin de créer dans lesdites couches des profils à pente inversée, la partie utile du faisceau optique étant la partie du faisceau optique qui contribue effectivement à créer lesdits profils. Dans un mode privilégiée de l'invention, le banc comporte des moyens (50) d'obturation partielle du faisceau optique situés au voisinage de l'optique de focalisation (23).
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