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1. (WO2012054263) MULTIPLE MATCHING REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2012/054263 International Application No.: PCT/US2011/055814
Publication Date: 26.04.2012 International Filing Date: 11.10.2011
IPC:
H01L 21/304 (2006.01) ,H01L 21/66 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
Applicants:
ZHANG, Jimin [US/US]; US (UsOnly)
WANG, Zhihong [CN/US]; US (UsOnly)
LEE, Harry Q. [US/US]; US (UsOnly)
TU, Wen-Chiang [US/US]; US (UsOnly)
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US (AllExceptUS)
Inventors:
ZHANG, Jimin; US
WANG, Zhihong; US
LEE, Harry Q.; US
TU, Wen-Chiang; US
Agent:
GOREN, David J.; Fish & Richardson P.C. P.O. Box 1022 Minneapolis, Minnesota 55440-1022, US
Priority Data:
61/405,11020.10.2010US
Title (EN) MULTIPLE MATCHING REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING
(FR) MULTIPLES SPECTRES DE RÉFÉRENCE PRÉSENTANT UNE CORRESPONDANCE POUR EFFECTUER UN CONTRÔLE OPTIQUE IN SITU
Abstract:
(EN) A method of controlling polishing includes storing a plurality libraries, each library including a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching first reference spectrum from a first library from the plurality of libraries and finding a best matching second reference spectrum from a different second library from the plurality of libraries, determining a first value associated with the best matching first reference spectrum and determining a second value from the best matching second reference spectrum, and calculating a third value from the first value and the second value to generate a sequence of calculated third values. At least one of a polishing endpoint or an adjustment for a polishing rate can be determined based on the sequence of calculated third values.
(FR) La présente invention se rapporte à un procédé de commande de polissage qui consiste à stocker une pluralité de bibliothèques, chaque bibliothèque comprenant une pluralité de spectres de référence, à polir un substrat, à mesurer une séquence des spectres de lumière provenant du substrat pendant le polissage, et, pour chaque spectre mesuré de la séquence de spectres, à trouver un premier spectre de référence qui correspond le mieux dans une première bibliothèque parmi la pluralité de bibliothèques et à trouver un second spectre de référence qui correspond le mieux dans une seconde bibliothèque différente parmi la pluralité de bibliothèques, à déterminer une première valeur associée au premier spectre de référence qui correspond le mieux et à déterminer une deuxième valeur à partir du second spectre de référence qui correspond le mieux, et à calculer une troisième valeur à partir de la première valeur et de la deuxième valeur afin de générer une séquence de troisièmes valeurs calculées. Un point final de polissage et/ou un ajustement du taux de polissage peuvent être déterminés sur la base de la séquence de troisièmes valeurs calculées.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)