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Machine translation
1. (WO2012054238) CHAMBER LID HEATER RING ASSEMBLY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/054238    International Application No.:    PCT/US2011/055100
Publication Date: 26.04.2012 International Filing Date: 06.10.2011
IPC:
H01L 21/3065 (2006.01), H01L 21/205 (2006.01), H01L 21/02 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054 (US) (For All Designated States Except US).
OUYE, Alan, H. [US/US]; (US) (For US Only).
SCOTT, Graeme [GB/US]; (US) (For US Only).
YU, Keven, Kaisheng [US/US]; (US) (For US Only).
GRIMBERGEN, Michael, N. [US/US]; (US) (For US Only)
Inventors: OUYE, Alan, H.; (US).
SCOTT, Graeme; (US).
YU, Keven, Kaisheng; (US).
GRIMBERGEN, Michael, N.; (US)
Agent: PATTERSON, Todd, B.; Patterson & Sheridan, L.L.P. 3040 Post Oak Blvd. Suite 1500 Houston, TX 77056-6582 (US)
Priority Data:
61/394,521 19.10.2010 US
13/253,627 05.10.2011 US
Title (EN) CHAMBER LID HEATER RING ASSEMBLY
(FR) ENSEMBLE ANNULAIRE DE DISPOSITIF DE CHAUFFAGE À COUVERCLE POUR CHAMBRE
Abstract: front page image
(EN)Embodiments of the invention generally provide a lid heater for a plasma processing chamber. In one embodiment, a lid heater assembly is provided that includes a thermally conductive base. The thermally conductive base has a planar ring shape defining an inner opening. The lid heater assembly further includes a heating element disposed on the thermally conductive base, and an insulated center core disposed across the inner opening of the thermally conductive base.
(FR)Des modes de réalisation de l'invention fournissent généralement un dispositif de chauffage à couvercle pour une chambre de traitement au plasma. Dans un mode de réalisation, un ensemble dispositif de chauffage à couvercle comprend une base thermoconductrice. La base thermoconductrice présente une forme annulaire plane définissant une ouverture intérieure. L'ensemble dispositif de chauffage à couvercle comprend en outre un élément chauffant disposé sur la base thermoconductrice, et un noyau central isolé disposé sur toute l'étendue de l'ouverture intérieure de la base thermoconductrice.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)