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1. (WO2012053757) DEVICE AND METHOD FOR FORMING A SEALING MATERIAL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/053757    International Application No.:    PCT/KR2011/007428
Publication Date: 26.04.2012 International Filing Date: 07.10.2011
IPC:
B29C 45/14 (2006.01), B29C 39/10 (2006.01)
Applicants: SHINHAN DIAMOND IND. CO., LTD. [KR/KR]; 10Lot 36Block, 610-9, Namchon-dong, Namdong-gu Incheon 405-100 (KR) (For All Designated States Except US).
SEUK, Dae Su [KR/KR]; (KR) (For US Only).
PARK, Eun Sook [KR/KR]; (KR) (For US Only).
CHOI, Young Gyu [KR/KR]; (KR) (For US Only).
HWANG, Dong Joo [KR/KR]; (KR) (For US Only)
Inventors: SEUK, Dae Su; (KR).
PARK, Eun Sook; (KR).
CHOI, Young Gyu; (KR).
HWANG, Dong Joo; (KR)
Agent: AIP PATENT & LAW FIRM; Shinwon Bldg. 8F, 823-14, Yeoksam-dong, Gangnam-gu Seoul 135-933 (KR)
Priority Data:
10-2010-0101948 19.10.2010 KR
Title (EN) DEVICE AND METHOD FOR FORMING A SEALING MATERIAL
(FR) DISPOSITIF ET PROCÉDÉ POUR FORMER UN MATÉRIAU D'ÉTANCHÉITÉ
(KO) 봉지재 성형장치 및 방법
Abstract: front page image
(EN)Disclosed is a device for forming a sealing material using an overmolding method, which is adapted to form a sealing material having a reliable thickness, and particularly, to form a sealing material on a substrate such as a lead frame having a through-hole. The device for forming a sealing material includes: a stationary mold on which a substrate is placed; a movable mold facing the stationary mold; an insert cavity block disposed between the movable mold and the stationary mold; and a resin load space disposed between the insert cavity block and the movable mold. The insert cavity block is provided with forming cavities facing the substrate, and a resin transfer path extending from the resin load space to the forming cavities.
(FR)Le dispositif ci-décrit permet de former un matériau d'étanchéité par la méthode du surmoulage, qui est adaptée pour former un matériau d'étanchéité ayant une épaisseur fiable et, en particulier, pour former un matériau d'étanchéité sur un substrat tel qu'un châssis en plomb comportant un trou débouchant. Le dispositif permettant de former un matériau d'étanchéité selon l'invention comprend : un moule fixe sur lequel est placé un substrat ; un moule mobile en regard du moule fixe ; un bloc empreinte placé entre le moule mobile et le moule fixe ; et un espace pour la charge de résine qui se trouve entre le bloc empreinte et le moule mobile. Le bloc empreinte comporte des empreintes de cavités en regard du substrat, et un canal de transfert de résine s'étendant depuis l'espace pour la charge de résine jusqu'aux empreintes de cavités.
(KO)본 명세서는 오버몰딩 방식이면서도, 신뢰성 있는 두께 치수로 봉지재를 성형할 수 있으며, 관통 구멍이 존재하는 리드프레임과 같은 기판 상에 봉지재를 성형하는데 특히 적합한 봉지재 성형장치를 개시한다. 개시된 봉지재 성형장치는, 기판이 장착되는 고정금형과; 상기 고정금형과 대향되게 배치되는 가동금형과; 상기 고정금형과 상기 가동금형 사이에 위치하는 인서트 캐비티 블록과; 상기 인서트 캐비티 블록과 상기 가동금형 사이에 제공되는 수지 적재 공간을 포함하며,상기 인서트 캐비티 블록에는 상기 기판과 대면하는 성형 캐비티들과, 상기 수지 적재 공간으로부터 상기 성형 캐비티로 이어진 수지 이동 경로가 형성된다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)