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1. (WO2012053448) BASE FILM OF TAPE FOR SEMICONDUCTOR PRODUCTION PROCESS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/053448    International Application No.:    PCT/JP2011/073689
Publication Date: 26.04.2012 International Filing Date: 14.10.2011
IPC:
H01L 21/301 (2006.01), C09J 7/02 (2006.01)
Applicants: ACHILLES CORPORATION [JP/JP]; 22-5, Daikyo-cho, Shinjuku-ku, Tokyo 1608885 (JP) (For All Designated States Except US).
KOBAYASHI, Syuichi [JP/JP]; (JP) (For US Only)
Inventors: KOBAYASHI, Syuichi; (JP)
Agent: HANABUSA, Tsuneo; c/o Hanabusa Patent Office, Shin-Ochanomizu Urban Trinity, 2, Kandasurugadai 3-chome, Chiyoda-ku Tokyo 1010062 (JP)
Priority Data:
2010-236363 21.10.2010 JP
Title (EN) BASE FILM OF TAPE FOR SEMICONDUCTOR PRODUCTION PROCESS
(FR) FILM DE BASE POUR BANDE DESTINÉ À UN PROCESSUS DE FABRICATION DE SEMI-CONDUCTEUR
(JA) 半導体製造工程用テープの基材フィルム
Abstract: front page image
(EN)[Problem] Provide a base film of a tape for a semiconductor production process. [Solution] The base film of a tape for a semiconductor production process is a substrate film formed from A) an ionomer resin that is obtained by subjecting a dipolymer, the polymer structural units of which are ethylene and (meth)acrylic acid, to crosslinking by metal ions, and B) a substance containing a terpolymer, the polymer structural components of which are ethylene, (meth)acrylic acid, and (meth)acrylic acid alkyl ester, wherein the amount of component B) used is within a range of at least 5 mass% to no more than 50 mass% on the basis of the total amount of components A) + B).
(FR)L'invention concerne un film de base pour bande destiné à un processus de fabrication de semi-conducteur. Plus précisément, le film de base de l'invention contient : (A) une résine ionomère dans laquelle un copolymère binaire ayant pour principal composant constitutif de polymère un éthylène et un acide (méth)acrylique, est réticulé par un ion métallique; et (B) un copolymère ternaire ayant pour composant constitutif de polymère un éthylène, un acide (méth)acrylique, et un alkylester d'acide (méth)acrylique. La quantité de composant (B) mis en œuvre, est comprise entre au moins 5% en masse et au plus 50% en masse, sur la base de la somme des composants (A)+(B).
(JA)【課題】 半導体製造工程用テープの基材フィルムを提供する。 【解決手段】半導体製造工程用テープの基材フィルムであって、 A)エチレン及び(メタ)アクリル酸を重合体の構成成分とする2元共重合体を金属イオンで架橋したアイオノマー樹脂、並びに B)エチレン、(メタ)アクリル酸及び(メタ)アクリル酸アルキルエステルを重合体の構成成分とする3元共重合体 を含むものからなり、前記成分B)の使用量が、成分A)+B)の総量に基づき、5質量%以上であり且つ50質量%以下の範囲である基材フィルム。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)