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1. (WO2012053070) LASER LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING LASER LIGHT SOURCE MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/053070    International Application No.:    PCT/JP2010/068463
Publication Date: 26.04.2012 International Filing Date: 20.10.2010
IPC:
H01S 5/022 (2006.01)
Applicants: PIONEER CORPORATION [JP/JP]; 1-1, Shin-ogura, Saiwai-ku, Kawasaki-shi, Kanagawa 2120031 (JP) (For All Designated States Except US).
GE, Xiao Tang [CN/JP]; (JP) (For US Only).
SHIMOSAWA, Ryosuke [JP/JP]; (JP) (For US Only).
UTSUBOYA, Osami [JP/JP]; (JP) (For US Only)
Inventors: GE, Xiao Tang; (JP).
SHIMOSAWA, Ryosuke; (JP).
UTSUBOYA, Osami; (JP)
Agent: NAKAMURA, Toshinobu; c/o TOKYO CENTRAL PATENT FIRM, 3rd Floor, Oak Building Kyobashi, 16-10, Kyobashi 1-chome, Chuou-ku, Tokyo 1040031 (JP)
Priority Data:
Title (EN) LASER LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING LASER LIGHT SOURCE MODULE
(FR) MODULE DE SOURCES DE LUMIÈRE LASER ET PROCÉDÉ DE FABRICATION D'UN MODULE DE SOURCES DE LUMIÈRE LASER
(JA) レーザ光源モジュール及びレーザ光源モジュールの製造方法
Abstract: front page image
(EN)Provided is a laser light source module, which is provided with a plurality of laser light sources, a synthesizing element, a light receiving element, a case section, and a sealing section. The synthesizing element overlaps laser beams outputted from the laser light sources. The light receiving element detects the intensities of the laser beams outputted from the laser light sources. The case section houses the laser light sources and the synthesizing element. The sealing section seals the case section. The light receiving element is attached to the sealing section.
(FR)L'invention concerne un module de sources de lumière laser qui comprend une pluralité de sources de lumière laser, un élément synthétiseur, un élément photorécepteur, une section boîtier et une section fermeture. L'élément synthétiseur superpose les faisceaux laser produits par les sources de lumière laser. L'élément photorécepteur détecte les intensités des faisceaux laser produits par les sources de lumière laser. La section boîtier abrite les sources de lumière laser et l'élément synthétiseur. La section fermeture ferme de manière étanche la section boîtier. L'élément photorécepteur est fixé sur la section fermeture.
(JA) レーザ光源モジュールは、複数のレーザ光源と、合成素子と、受光素子と、ケース部と、封止部と、を備える。合成素子は、レーザ光源から出射されたレーザ光を重ね合わせる。受光素子は、レーザ光源から出射されたレーザ光の強度を検出する。ケース部は、レーザ光源と、合成素子とを収納する。封止部は、ケース部を封止する。そして、受光素子は、封止部に取り付けられている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)