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Machine translation
1. (WO2012052611) DEVICE WITH MOLD CAP AND METHOD THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/052611    International Application No.:    PCT/FI2011/050832
Publication Date: 26.04.2012 International Filing Date: 27.09.2011
IPC:
H01L 23/31 (2006.01), H01L 25/065 (2006.01), B29C 45/14 (2006.01)
Applicants: NOKIA CORPORATION [FI/FI]; Keilalahdentie 4 FI-02150 Espoo (FI) (For All Designated States Except US).
ISHIBASHI, Kazuo [JP/JP]; (JP) (For US Only)
Inventors: ISHIBASHI, Kazuo; (JP)
Agent: NOKIA CORPORATION; IPR Department Ari Aarnio Keilalahdentie 4 FI-02150 Espoo (FI)
Priority Data:
12/925,487 21.10.2010 US
Title (EN) DEVICE WITH MOLD CAP AND METHOD THEREOF
(FR) DISPOSITIF COMPORTANT UN CAPUCHON MOULÉ, ET PROCÉDÉ CORRESPONDANT
Abstract: front page image
(EN)A device (10) including a substrate (12); at least one semiconductor die (14) on a first side (20) of the substrate; and a mold cap (18) molded on portions of the first side (20) of the substrate and on lateral sides (24) of the at least one semiconductor die. The mold cap (18) is not molded onto a top side (48) of the at least one semiconductor die.
(FR)L'invention concerne un dispositif (10) comprenant un substrat (12) ; au moins une puce de semiconducteur (14) placée sur un premier côté (20) du substrat ; et un capuchon moulé (18) qui est moulé sur des parties du premier côté (20) et sur les faces latérales (24) de ladite ou desdites puces de semiconducteur. Le capuchon moulé (18) n'est pas moulé sur un côté supérieur (48) de ladite ou desdites puces de semiconducteur.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)