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Machine translation
1. (WO2012051340) MICROPHONE PACKAGE WITH EMBEDDED ASIC
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/051340    International Application No.:    PCT/US2011/056017
Publication Date: 19.04.2012 International Filing Date: 12.10.2011
IPC:
H04R 19/00 (2006.01), H04R 19/04 (2006.01), B81C 1/00 (2006.01)
Applicants: ANALOG DEVICES, INC. [US/US]; One Technology Way Norwood, MA 02062-9106 (US) (For All Designated States Except US).
DELAUS, Michael, D. [US/US]; (US) (For US Only).
O'DONNELL, Kathy [US/US]; (US) (For US Only).
GOIDA, Thomas, M. [US/US]; (US) (For US Only)
Inventors: DELAUS, Michael, D.; (US).
O'DONNELL, Kathy; (US).
GOIDA, Thomas, M.; (US)
Agent: SUNSTEIN, Bruce, D.; Sunstein Kann Murphy & Timbers LLP 125 Summer Street Boston, MA 02110 (US)
Priority Data:
61/392,322 12.10.2010 US
Title (EN) MICROPHONE PACKAGE WITH EMBEDDED ASIC
(FR) BOÎTIER DE MICROPHONE À CIRCUIT INTÉGRÉ SPÉCIFIQUE (ASIC) INCORPORÉ
Abstract: front page image
(EN)A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.
(FR)L'invention porte sur un microphone en boîtier qui présente une base, un couvercle couplé à la base formant une partie intérieure, un microphone MEMS fixé à la base à l'intérieur de la partie intérieure, et un circuit intégré incorporé dans la base. Des ouvertures dans la base et le circuit intégré sont alignées pour former une ouverture de l'extérieur du boîtier à l'intérieur.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)