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Machine translation
1. (WO2012050117) SUPPORTING BODY AND WAFER FILM FORMATION METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/050117    International Application No.:    PCT/JP2011/073403
Publication Date: 19.04.2012 International Filing Date: 12.10.2011
IPC:
H01L 21/31 (2006.01), C23C 14/50 (2006.01), C23C 16/458 (2006.01)
Applicants: BRIDGESTONE CORPORATION [JP/JP]; 10-1, Kyobashi 1-chome, Chuo-ku, Tokyo 1048340 (JP) (For All Designated States Except US).
USHITA, Kazuhiro; (For US Only)
Inventors: USHITA, Kazuhiro;
Agent: MIYOSHI, Hidekazu; Toranomon Kotohira Tower, 2-8, Toranomon 1-chome, Minato-ku, Tokyo 1050001 (JP)
Priority Data:
2010-229449 12.10.2010 JP
Title (EN) SUPPORTING BODY AND WAFER FILM FORMATION METHOD
(FR) CORPS DE SUPPORT ET PROCÉDÉ DE FORMATION DE FILM DE TRANCHE
(JA) 支持体及びウエハ成膜処理方法
Abstract: front page image
(EN)Disclosed is a supporting body which is used in a semiconductor device manufacturing process and has an upper surface that is provided with a recessed portion in which a wafer is disposed. The supporting body is formed of silicon carbide, and the recessed portion has a generally circular shape when viewed in plan and has a bottom portion that is composed of a plurality of annular steps that are concentrically arranged around the center of the recessed portion when viewed in plan.
(FR)L'invention porte sur un corps de support qui est utilisé dans un procédé de fabrication de dispositif à semi-conducteurs et a une surface supérieure qui comporte une partie renfoncée dans laquelle une tranche est disposée. Le corps de support est formé de carbure de silicium, et la partie renfoncée a une forme généralement circulaire dans une vue en plan et a une partie inférieure qui est composée d'une pluralité d'échelons annulaires qui sont agencés de manière concentrique autour du centre de la partie renfoncée, dans une vue en plan.
(JA) 半導体デバイス製造工程において用いられ、ウエハを載置する凹部が設けられている上面を有する支持体であって、支持体は、炭化ケイ素によって形成されており、凹部は、平面視において略円形状であるとともに、平面視における前記凹部の中心を中心とした同心円状に設けられた複数の円環状の段によって形成されている底部を有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)