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Machine translation
1. (WO2012049352) METHOD AND ARRANGEMENT FOR ATTACHING A CHIP TO A PRINTED CONDUCTIVE SURFACE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/049352    International Application No.:    PCT/FI2010/050797
Publication Date: 19.04.2012 International Filing Date: 14.10.2010
Chapter 2 Demand Filed:    14.05.2012    
IPC:
H05K 3/32 (2006.01), H05K 13/04 (2006.01), B23K 20/02 (2006.01), B23K 20/04 (2006.01)
Applicants: STORA ENSO OYJ [FI/FI]; Pl 309 FI-00101 Helsinki (FI) (For All Designated States Except US).
MAIJALA, Juha [FI/FI]; (FI) (For US Only).
SIRVIÖ, Petri [FI/FI]; (FI) (For US Only)
Inventors: MAIJALA, Juha; (FI).
SIRVIÖ, Petri; (FI)
Agent: BERGGREN OY AB; P.O. Box 16 (Antinkatu 3 C) FI-00101 Helsinki (FI)
Priority Data:
Title (EN) METHOD AND ARRANGEMENT FOR ATTACHING A CHIP TO A PRINTED CONDUCTIVE SURFACE
(FR) PROCÉDÉ ET AGENCEMENT POUR LA FIXATION D'UNE PUCE SUR UNE SURFACE CONDUCTRICE IMPRIMÉE
Abstract: front page image
(EN)A chip (201) is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip (205, 206).
(FR)L'invention concerne une puce (201) qui est fixée sur une surface conductrice imprimée. La puce est d'abord chauffée à une première température qui est inférieure à ce que la puce peut supporter sans être endommagée par la chaleur. La puce chauffée est pressée contre la surface conductrice imprimée avec une première force de pression. Une combinaison de ladite première température et de ladite première force de pression est suffisante pour faire fondre au moins partiellement le matériau soit de la surface conductrice imprimée, soit du point de contact sur la puce (205, 206).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)