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Machine translation
1. (WO2012046338) SEMICONDUCTOR PACKAGE, COOLING MECHANISM, AND A METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/046338    International Application No.:    PCT/JP2010/067771
Publication Date: 12.04.2012 International Filing Date: 08.10.2010
IPC:
H01L 23/427 (2006.01), H01L 23/12 (2006.01), H01L 25/04 (2006.01), H01L 25/18 (2006.01), H05K 1/02 (2006.01), H05K 7/20 (2006.01)
Applicants: FUJITSU LIMITED [JP/JP]; 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-shi, Kanagawa 2118588 (JP) (For All Designated States Except US).
SHIOGA, Takeshi [JP/JP]; (JP) (For US Only).
NAGAOKA, Hideaki [JP/JP]; (JP) (For US Only).
KIMURA, Takahiro [JP/JP]; (JP) (For US Only)
Inventors: SHIOGA, Takeshi; (JP).
NAGAOKA, Hideaki; (JP).
KIMURA, Takahiro; (JP)
Agent: ITOH, Tadahiko; 16th Floor, Marunouchi MY PLAZA (Meiji Yasuda Seimei Building), 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
Title (EN) SEMICONDUCTOR PACKAGE, COOLING MECHANISM, AND A METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
(FR) BOÎTIER DE SEMI-CONDUCTEUR, MÉCANISME DE REFROIDISSEMENT ET PROCÉDÉ DE FABRICATION DU BOÎTIER DE SEMI-CONDUCTEUR
(JA) 半導体パッケージ、冷却機構、及び半導体パッケージの製造方法
Abstract: front page image
(EN)This semiconductor package is provided with a substrate on which a semiconductor device is mounted and a loop-shaped heat pipe joined to the surface on the opposite side from the mounting surface for the semiconductor device on that substrate. The substrate has a channel structure on the surface on the opposite side from the mounting surface, and this channel structure is connected with a porous body disposed within an evaporator of the loop-shaped heat pipe.
(FR)La présente invention a trait à un boîtier de semi-conducteur qui est équipé d'un substrat sur lequel un dispositif à semi-conducteur est monté et d'un caloduc en forme de boucle qui est joint à la surface située du côté opposé à la surface de montage du dispositif à semi-conducteur sur ce substrat. Le substrat est doté d'une structure de canaux sur la surface du côté opposé à la surface de montage, et cette structure de canaux est connectée à un corps poreux qui est disposé à l'intérieur d'un évaporateur du caloduc en forme de boucle.
(JA) 半導体パッケージは、半導体素子を実装する基板と、前記基板の前記半導体素子の実装面と反対側の面に接合されるループ型ヒートパイプとを備え、前記基板は前記実装面と反対側の面に溝構造を有し、当該溝構造は前記ループ型ヒートパイプの蒸発器の内部に配置された多孔質体と接触している。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)