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1. (WO2012044398) CORNER STRUCTURE FOR IC DIE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/044398    International Application No.:    PCT/US2011/046730
Publication Date: 05.04.2012 International Filing Date: 05.08.2011
Chapter 2 Demand Filed:    09.06.2012    
IPC:
H01L 21/56 (2006.01), H01L 23/00 (2006.01)
Applicants: XILINX, INC. [US/US]; 2100 Logic Drive San Jose, CA 95124 (US) (For All Designated States Except US)
Inventors: MARDI, Mohsen, H.; (US).
MAHONEY, David, M.; (US)
Agent: GEORGE, Thomas; Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124 (US)
Priority Data:
12/891,715 27.09.2010 US
Title (EN) CORNER STRUCTURE FOR IC DIE
(FR) STRUCTURE D'ANGLE POUR PUCE À CIRCUIT INTÉGRÉ
Abstract: front page image
(EN)One or more integrated circuit chips (102) are flip-chip bonded to a first surface of a substrate (104). A contact array (120) is fabricated on a second surface of the substrate. Corner structures (108, 1 10) attached to the integrated circuit chip cover at least two corners of the IC chip.
(FR)L'invention concerne une ou plusieurs puces à circuit intégré (102) qui sont liées en flip-chip à une première surface d'un substrat (104). Un réseau de contact (120) est fabriqué sur une seconde surface du substrat. Des structures d'angle (108, 110) liées à la puce à circuit intégré couvrent au moins deux angles de la puce à circuit intégré.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)