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1. (WO2012043971) METHOD FOR MANUFACTURING A FLEXIBLE ELECTRONIC DEVICE USING A ROLL-SHAPED MOTHERBOARD, FLEXIBLE ELECTRONIC DEVICE, AND FLEXIBLE SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/043971    International Application No.:    PCT/KR2011/004694
Publication Date: 05.04.2012 International Filing Date: 28.06.2011
IPC:
H01L 51/56 (2006.01), G02F 1/1333 (2006.01), G02F 1/167 (2006.01), H01L 29/786 (2006.01)
Applicants: POSCO [KR/KR]; 1 Koedong-dong, Nam-gu Pohang-si, Kyungsangbook-do 790-300 (KR) (For All Designated States Except US).
LEE, Jong Lam [KR/KR]; (KR) (For US Only).
KIM, Kee Soo [KR/KR]; (KR) (For US Only)
Inventors: LEE, Jong Lam; (KR).
KIM, Kee Soo; (KR)
Agent: C&S PATENT AND LAW OFFICE; 7th Floor, Daelim Acrotel 13 Eonju-ro 30-gil, Gangnam-Gu Seoul 135-971 (KR)
Priority Data:
10-2010-0094349 29.09.2010 KR
Title (EN) METHOD FOR MANUFACTURING A FLEXIBLE ELECTRONIC DEVICE USING A ROLL-SHAPED MOTHERBOARD, FLEXIBLE ELECTRONIC DEVICE, AND FLEXIBLE SUBSTRATE
(FR) PROCÉDÉ DE FABRICATION D'UN DISPOSITIF ÉLECTRONIQUE FLEXIBLE QUI UTILISE UNE CARTE MÈRE EN FORME DE ROULEAU, DISPOSITIF ÉLECTRONIQUE FLEXIBLE ET SUBSTRAT FLEXIBLE
(KO) 롤 형상의 모기판을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
Abstract: front page image
(EN)The objective of the present invention is to solve the problems of degraded performance and yield of a flexible electronic device due to low processable temperature, high surface roughness, high thermal expansion coefficient, and poor handling characteristics of existing flexible substrates. The method for manufacturing a flexible electronic device according to the present invention comprises the steps of: forming a flexible substrate on a roll-shaped motherboard; separating the flexible substrate from the roll-shaped motherboard; and forming an electronic device on a separated surface of the flexible substrate that contacted the motherboard.
(FR)Le but de la présente invention est de résoudre les problèmes de dégradation des performances et du rendement d'un dispositif électronique flexible dus à des caractéristiques de faibles températures de traitement, d'états de surface élevés, de coefficients de dilatation thermique élevés et de manipulations médiocres des substrats flexibles existants. Le procédé de fabrication d'un dispositif électronique flexible selon la présente invention comprend les étapes consistant à : former un substrat flexible sur une carte mère en forme de rouleau ; séparer le substrat flexible de la carte mère en forme de rouleau ; et former un dispositif électronique sur une surface séparée du substrat flexible qui est en contact avec la carte mère.
(KO)본 발명은 기존의 플렉서블 기판의 낮은 공정 가능 온도, 높은 표면 거칠기, 높은 열팽창 계수, 나쁜 핸들링 특성의 문제에 따른 플렉서블 전자소자의 성능 및 수율 저하의 문제점을 해결하기 위한 것이다. 본 발명에 따른 플렉서블 전자소자의 제조방법은 롤 형상 모기판 상에 플렉서블 기판을 형성하는 단계, 상기 플렉서블 기판을 롤 형상 모기판과 분리시키는 단계 및 상기 모기판과 접촉되어 있던 상기 플렉서블 기판의 분리면 상에 전자소자를 형성하는 단계를 포함하여 구성된다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)