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Machine translation
1. (WO2012043970) RAPIDLY-HEATABLE HEATING UNIT STRUCTURE FOR A DEVICE FOR TREATING SEBACEOUS GLAND DISEASE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/043970    International Application No.:    PCT/KR2011/004674
Publication Date: 05.04.2012 International Filing Date: 28.06.2011
IPC:
A61B 18/04 (2006.01), A61F 7/00 (2006.01), A61N 1/00 (2006.01)
Applicants: PARK, Se Hwan [KR/KR]; (KR)
Inventors: PARK, Se Hwan; (KR)
Agent: KIM, Bok Su; 319 Twoone Blessbill, 523-2 Gojan-dong, Danwoen-gu Ansan-si, Kyungi-do 425-020 (KR)
Priority Data:
20-2010-0010077 30.09.2010 KR
Title (EN) RAPIDLY-HEATABLE HEATING UNIT STRUCTURE FOR A DEVICE FOR TREATING SEBACEOUS GLAND DISEASE
(FR) STRUCTURE D'UNITÉ CHAUFFANTE RAPIDE À CHAUFFER UTILISÉE POUR UN DISPOSITIF DE TRAITEMENT DES MALADIES DES GLANDES SÉBACÉES
(KO) 급속 가열이 가능한 피지선 질환 치료장치의 발열부 구조
Abstract: front page image
(EN)The present invention relates to a rapidly-heatable heating unit structure for a device for treating sebaceous gland disease, in which a printed circuit board (PCB, 5) for a heating material part having a heating material (4) disposed therein is mounted at an upper portion of a PCB (6) vertically to the PCB (6) and parallel to a skin-contacting surface of a skin-contacting housing (2). Since the heating material (4) and a temperature sensor (3) are mounted on an upper surface of the PCB (5) for the heating material part, the volume of the space between the skin-contacting housing (2) and the heating material (4) is minimized, and the heat of the heating material (4) is transmitted to the skin-contacting housing (2) within a short period of time for convenient and quick use.
(FR)La présente invention concerne une structure d'unité chauffante rapide à chauffer utilisée pour un dispositif de traitement des maladies des glandes sébacées. Une carte de circuit imprimé (PCB, 5) d'une partie matériau chauffant contenant un matériau chauffant (4) est montée au niveau d'une partie supérieure d'une PCB (6), à la verticale de ladite PCB (6) et de manière parallèle à la surface de contact avec la peau d'un boîtier de contact avec la peau (2). Etant donné que le matériau chauffant (4) et un capteur de température (3) sont montés sur une face supérieure de la PCB (5) de la partie matériau chauffant, le volume de l'espace entre le boîtier de contact avec la peau (2) et le matériau chauffant (4) est réduit à un minimum, et la chaleur du matériau chauffant (4) est transmise au boîtier de contact avec la peau (2) en un court délai pour une utilisation pratique et rapide.
(KO)본 발명은 급속가열이 가능한 피지선질환 치료장치의 발열부구조에 관한 것으로, 더욱 상세하게는 발열체(4)가 설치되는 발열체부 PCB(5)를 PCB기판(6)에는 수직으로, 피부접촉하우징(2)의 피부접촉면과는 평행이 되게 PCB기판(6) 상부에 착설하여 발열체부 PCB(5)의 상면에 발열체(4)와 온도센서(3)를 착설하므로서 피부접촉하우징(2)과 발열체(4)와의 사이의 공간부의 체적을 최소화시켜 발열체(4)의 열기가 피부접촉하우징(2)에 단시간에 전달되게 하므로서 사용자가 간편하고 신속하게 사용할 수 있도록 한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)