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1. (WO2012042869) EXPANDABLE FILM, DICING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/042869    International Application No.:    PCT/JP2011/005466
Publication Date: 05.04.2012 International Filing Date: 28.09.2011
IPC:
H01L 21/301 (2006.01), C09J 7/02 (2006.01), C09J 201/00 (2006.01)
Applicants: Mitsui Chemicals, Inc. [JP/JP]; 5-2, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo 1057117 (JP) (For All Designated States Except US).
HAYASHISHITA, Eiji; (For US Only).
OZAKI, Katsutoshi; (For US Only).
SAKAI, Mitsuru; (For US Only).
OIKE, Setsuko; (For US Only)
Inventors: HAYASHISHITA, Eiji; .
OZAKI, Katsutoshi; .
SAKAI, Mitsuru; .
OIKE, Setsuko;
Agent: WASHIDA, Kimihito; 8th Floor, Shinjuku First West Bldg., 1-23-7, Nishi-Shinjuku, Shinjuku-ku, Tokyo 1600023 (JP)
Priority Data:
2010-222046 30.09.2010 JP
2011-082113 01.04.2011 JP
Title (EN) EXPANDABLE FILM, DICING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
(FR) FILM EXPANSIBLE, FILM DE DÉCOUPAGE EN DÉ, ET PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEUR
(JA) 拡張性フィルム、ダイシングフィルム、および半導体装置の製造方法
Abstract: front page image
(EN)The present invention addresses the problem of obtaining an olefinic expandable base material that has low contamination, has a high degree of expandability, which has been insufficient in conventional olefinic expandable base materials, and makes the occurrence of necking difficult. Also addressed is obtaining a dicing film. To address these problems, this base material contains a 1-butene·α-olefin copolymer (A) for which the tensile modulus of elasticity is 100 - 500 MPa at 23°C and a propylene elastomer composition (B) that contains a propylene·α-olefin copolymer (b1) and has a tensile modulus of elasticity of 10 - 50 MPa at 23°C. An expandable film is formed such that the propylene elastomer composition (B) content is 30 - 70 parts by weight to 100 parts by weight for the total of (A) and (B).
(FR)La présente invention concerne l'obtention d'un matériau de base expansible oléfinique qui possède une faible contamination, un haut degré de capacité d'expansion, qui est insuffisant dans les matériaux de base expansibles oléfiniques classiques, et rende l'occurrence de striction difficile. La présente invention concerne également l'obtention d'un film de découpage en dé. Pour résoudre ces problèmes, ce matériau de base contient un copolymère 1-butène·α-oléfine (A) pour lequel le module d'élasticité à la traction est 100 à 500 MPa à 23 °C et une composition d'élastomère propylène (B) qui contient un copolymère propylène·α-oléfine (b1) et possède un module d'élasticité à la traction de 10 à 50 MPa à 23 °C. Un film expansible est formé de sorte que la teneur en composition d'élastomère propylène (B) soit 30 à 70 parties en poids pour 100 parties en poids pour le total de (A) et de (B).
(JA) 低汚染であり、従来のオレフィン系拡張性基材では不十分であった、高い拡張性を有し、ネッキングし難いオレフィン系拡張性基材およびダイシングフィルムを得ることを課題とする。 上記課題を達成するため、23℃における引張弾性率が100~500MPaである1-ブテン・α-オレフィン共重合体(A)と、プロピレン・α-オレフィン共重合体(b1)を含み、23℃における引張弾性率が10~50MPaであるプロピレン系エラストマー組成物(B)と、を含む基材であって、前記(B)の含有量は、(A)と(B)の合計100重量部に対して、30~70重量部である、拡張性フィルムとする。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)