WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2012041838) BONDING USING HOT-MELT ADHESIVES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/041838    International Application No.:    PCT/EP2011/066745
Publication Date: 05.04.2012 International Filing Date: 27.09.2011
IPC:
C09J 123/14 (2006.01)
Applicants: HENKEL AG & CO. KGAA [DE/DE]; Henkelstr. 67 40589 Düsseldorf (DE) (For All Designated States Except US).
LOTZ, Jürgen [DE/DE]; (DE) (For US Only).
KASPER, Dirk [DE/DE]; (DE) (For US Only).
PIELERT, Lutz [DE/DE]; (DE) (For US Only)
Inventors: LOTZ, Jürgen; (DE).
KASPER, Dirk; (DE).
PIELERT, Lutz; (DE)
Priority Data:
10 2010 041 463.8 27.09.2010 DE
Title (DE) VERKLEBUNG MIT SCHMELZKLEBSTOFFEN
(EN) BONDING USING HOT-MELT ADHESIVES
(FR) COLLAGE PAR ADHÉSIFS THERMOFUSIBLES
Abstract: front page image
(DE)Die Erfindung betrifft die Verwendung eines Schmelzklebstoffs mit hoher Härte zur Verklebung von Metall-, Papier- und/oder Kunststofffolien. Die Erfindung betrifft weiterhin ein Verfahren zum Verkleben einer Metall-, Papier- und/oder Kunststofffolie auf einem Substrat.
(EN)The invention relates to the use of a hot-melt adhesive having high hardness for bonding metal, paper and/or plastic films or foils. The invention further relates to a method for bonding a metal, paper and/or plastic film or foil to a substrate.
(FR)L'invention concerne l'utilisation d'un adhésif thermofusible à dureté élevée pour coller des feuilles de métal, de papier et/ou des films plastiques. L'invention concerne en outre un procédé pour coller une feuille métallique, une feuille de papier et/ou un film plastique sur un substrat.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: German (DE)
Filing Language: German (DE)