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1. (WO2012032451) AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2012/032451 International Application No.: PCT/IB2011/053867
Publication Date: 15.03.2012 International Filing Date: 05.09.2011
IPC:
C09G 1/02 (2006.01) ,C09G 1/04 (2006.01) ,C09G 1/18 (2006.01) ,C09K 3/14 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
G
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1
Polishing compositions
02
containing abrasives or grinding agents
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
G
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1
Polishing compositions
04
Aqueous dispersions
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
G
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1
Polishing compositions
06
Other polishing compositions
14
based on non-waxy substances
18
on other substances
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
Applicants:
LI, Yuzhuo [US/DE]; DE (UsOnly)
CHU, Jea-Ju; TW (UsOnly)
VENKATARAMAN, Shyam Sundar; TW (UsOnly)
CHIU, Wei Lan William; TW (UsOnly)
PINDER, Harvey Wayne [US/US]; US (UsOnly)
BASF SE [DE/DE]; 67056 Ludwigshafen, DE (AllExceptUS)
BASF (CHINA) COMPANY LIMITED [CN/CN]; 300 Jiangxinsha Road Shanghai, 200137, CN (MN)
Inventors:
LI, Yuzhuo; DE
CHU, Jea-Ju; TW
VENKATARAMAN, Shyam Sundar; TW
CHIU, Wei Lan William; TW
PINDER, Harvey Wayne; US
Common
Representative:
BASF SE; 67056 Ludwigshafen, DE
Priority Data:
61/380,71908.09.2010US
Title (EN) AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS
(FR) COMPOSITION AQUEUSE DE POLISSAGE ET PROCÉDÉ DE POLISSAGE MÉCANO-CHIMIQUE DE SUBSTRATS CONTENANT DES FILMS DIÉLECTRIQUES D'OXYDE DE SILICIUM ET DES FILMS DE POLYSILICIUM
Abstract:
(EN) An aqueous polishing composition has been found, the said aqueous polishing composition comprising (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and (C) at least one anionic phosphate dispersing agent; and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.
(FR) L'invention concerne une composition aqueuse de polissage comprenant (A) au moins un type de particules abrasives qui sont chargées positivement lorsqu'elles sont en dispersion dans un milieu aqueux exempt de composant (B) et présentant un pH compris entre 3 et 9, tel que mis en évidence par la mobilité électrophorétique; (B) au moins un polymère hydrosoluble choisi dans le groupe comprenant des copolymères et des homopolymères d'oxyde d'alkylène linéaires et ramifiés; et (C) au moins un agent dispersant phosphaté anionique. L'invention concerne également un procédé de polissage de matériaux de substrat pour des dispositifs électriques, mécaniques et optiques au moyen de ladite composition aqueuse de polissage.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)